Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device
View Patent ↗In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.
1. A wafer processing tape having a pasting region to be pasted to a wafer ring used when processing a semiconductor wafer,
the wafer processing tape comprising:
a release base material constituting a base of the tape;
an adhesive layer provided on one surface of the release base material so as to correspond to a planar shape of the semiconductor wafer;
a tacky material layer provided so as to cover the adhesive layer; and
a base material film provided so as to cover the tacky material layer,
wherein:
in a plan view, regions of the tacky material layer and the base material film protruding outward from the adhesive layer serve as the pasting region to the wafer ring,
in the plan view, at least one notched part is formed entirely outside the adhesive layer, in the base material film and the tacky material layer in the pasting region, to a depth reaching the release base material from the side of the base material film, the notched part being spaced inwardly from an outer perimeter of the pasting region, and
in the plan view, a part of the tacky material layer and the base material film in the pasting region is partitioned by the notched part into:
(a) a first portion nearer than the notched part to the center of the adhesive layer, and
(b) a second portion more distant than the notched part from the center of the adhesive layer but continuous with the first portion around the notched part, and having a flap bounded by the notched part so as to be embraced by the notched part and to protrude toward the center of the adhesive layer.
2. The wafer processing tape according to claim 1 , wherein a plurality of said notched parts are arranged discontinuously from each other along the pasting region so as to define a plurality of said flaps.
3. The wafer processing tape according to claim 1 , including at least one additional notched part formed entirely outside the adhesive layer and defining a flap that faces away from the outside of the adhesive layer, as seen in the plan view.
4. The wafer processing tape according to claim 1 , wherein the at least one notched part does not penetrate the release base material.
5. The wafer processing tape according to claim 1 , wherein the at least one notched part extends partially through the thickness of the release base material.
6. A wafer processing tape having a pasting region to be pasted to a wafer ring used when processing a semiconductor wafer,
the wafer processing tape comprising:
a release base material constituting a base of the tape;
an adhesive layer provided on one surface of the release base material so as to correspond to a planar shape of the semiconductor wafer;
a tacky material layer provided so as to cover the adhesive layer; and
a base material film provided so as to cover the tacky material layer,
wherein:
in a plan view, regions of the tacky material layer and the base material film protruding outward from the adhesive layer serve as a pasting region to the wafer ring,
in the plan view, the pasting region includes a flap formed entirely outside the adhesive layer, spaced inwardly from an outer perimeter of the pasting region, defined by a notch part spaced inwardly from an outer perimeter of the pasting region, the flap and protruding toward a center of the adhesive layer, and
the flap extends to a depth reaching the release base material from the side of the base material film.