Patent Assignment
Reel/Frame 035795/0992
Change of Address
Recorded: 2015-05-29
Pages: 2
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Wafer Processing Tape, Method of Manufacturing Wafer Processing Tape, and Method of Manufacturing Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2012
From: TANIGUCHI, KOUHEI; MATSUZAKI, TAKAYUKI; KATOU, SHINYA; KOMORIDA, KOUJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 027474/0443 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →