Patent Assignment
Reel/Frame 027474/0443
Assignment of Assignor's Interest
Recorded: 2012-01-04
Pages: 4
Assignors
TANIGUCHI, KOUHEI
Executed: 2011-10-24
MATSUZAKI, TAKAYUKI
Executed: 2011-10-27
KATOU, SHINYA
Executed: 2011-10-28
KOMORIDA, KOUJI
Executed: 2011-10-24
MASHINO, MICHIO
Executed: 2011-10-24
SAKUTA, TATSUYA
Executed: 2011-10-24
KATOU, RIE
Executed: 2011-10-24
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Wafer Processing Tape, Method of Manufacturing Wafer Processing Tape, and Method of Manufacturing Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
May 29, 2015
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 035795/0992 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →