Polishing agent, polishing agent set and method for polishing base

1. A polishing agent, containing:

a liquid medium;

an abrasive grain including a hydroxide of a tetravalent metal element;

a polymer compound having an aromatic ring and a polyoxyalkylene chain; and

a cationic polymer, wherein

a weight average molecular weight of the polymer compound is 1000 or more.

2. The polishing agent according to claim 1 , wherein the tetravalent metal element includes at least one selected from the group consisting of a rare earth element and zirconium.

3. The polishing agent according to claim 1 , wherein a content of the polymer compound is 0.01 mass % or more based on a total mass of the polishing agent.

4. The polishing agent according to claim 1 , wherein the polymer compound includes a compound represented by the following general formula (I):

R 11 —O—(R 12 —O) m1 —H  (I),

wherein, in formula (I), R 11 represents an aryl group which may have a substituent, R 12 represents an alkylene group having 1 to 5 carbon atoms, which may have a substituent, and m1 represents an integer of 15 or more.

5. The polishing agent according to claim 1 , which is used for polishing a surface to be polished including silicon oxide.

6. A polishing agent set, wherein constituents of the polishing agent according to claim 1 are stored with being separated to a first liquid and a second liquid, the first liquid contains the abrasive grain and a liquid medium, and the second liquid contains the polymer compound, the cationic polymer and a liquid medium.

7. A method for polishing a base, comprising a step of polishing a surface to be polished of a base by use of the polishing agent according to claim 1 .

8. A method for polishing a base, comprising a step of polishing a surface to be polished of a base by use of a polishing agent obtained by mixing the first liquid and the second liquid of the polishing agent set according to claim 6 .