Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound
An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
1. An epoxy compound represented by the following Formula (1):
wherein, in Formula (1), each X independently represents a partial structure excluding epoxy groups derived from two glycidyl groups of 4-{4-(2,3-epoxypropoxy)phenyl}cyclohexyl 4-(2,3-epoxypropoxy)benzoate, and Y represents a phenylene group optionally having a substituent.
2. The epoxy compound according to claim 1 , represented by at least one of the following Formulae (2-1) to (2-3):
3. The epoxy compound according to claim 1 , represented by at least one of the following Formulae (3-1) to (3-3):
4. The epoxy compound according to claim 1 , represented by at least one of the following Formulae (4-1) to (4-3):
5. An inorganic filler-containing epoxy resin composition, comprising:
the epoxy compound according to claim 1 ; and
an inorganic filler.
6. The inorganic filler-containing epoxy resin composition according to claim 5 , wherein a content of the epoxy compound in the inorganic filler-containing epoxy resin composition is from 1 to 50% by mass.
7. The inorganic filler-containing epoxy resin composition according to claim 5 , wherein a content of the inorganic filler is from 60 to 90% by volume with respect to a total volume of the inorganic filler-containing epoxy resin composition being 100% by volume.
8. The inorganic filler-containing epoxy resin composition according to claim 5 , wherein a content of the epoxy compound in the inorganic filler-containing epoxy resin composition is from 1 to 50% by mass.
9. The inorganic filler-containing epoxy resin composition according to claim 8 wherein a content of the epoxy compound in the inorganic filler-containing epoxy resin composition is from 30% by mass or less.
10. The inorganic filler-containing epoxy resin composition according to claim 5 , wherein a content of the epoxy compound in the inorganic filler-containing epoxy resin composition is from 5 to 30% by mass.
11. The inorganic filler-containing epoxy resin composition according to claim 5 , wherein a content of the inorganic filler is from 70 to 85% by volume with respect to a total volume of the inorganic filler-containing epoxy resin composition being 100% by volume.
12. The inorganic filler-containing epoxy resin composition according to claim 5 , further comprising a phenol curing agent.