IP Library Assignment 054825/0559
Patent Assignment
Reel/Frame 054825/0559

Change of Name

Recorded: 2020-12-22 Pages: 32
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Epoxy Resin, Epoxy Resin Composition, Inorganic Filler-Containing Epoxy Resin Composition, Resin Sheet, Cured Product, and Epoxy Compound
Application: 16/400,073 →
Publication: US 2019/0256643
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 1, 2019
From: KATAGI, HIDEYUKI; TANAKA, KENJI; TAKEZAWA, YOSHITAKA; SUE, HARUAKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 049048/0074 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →