IP Library Granted Patent US 8,171,628
Granted Patent B2
US 8,171,628 · App. 13/060,114 · Granted May 8, 2012

Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate

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Quick Facts
Patent No.
US 8,171,628
App. No.
13/060,114
Granted
May 8, 2012
Kind
B2
Abstract

A photosensitive conductive film 10 according to the invention includes a support film 1 , a conductive layer 2 containing conductive fiber formed on the support film 1 , and a photosensitive resin layer 3 formed on the conductive layer 2.

Claims (7)

1. A method for forming a conductive pattern comprising:

a step of laminating a photosensitive conductive film comprising a support film, a conductive layer containing conductive fiber formed on the support film, and a photosensitive resin layer formed on the conductive layer so that the photosensitive resin layer is tightly attached onto a substrate;

an exposure step of irradiating a predetermined part of the photosensitive resin layer on the substrate with actinic light; and

a development step of developing the exposed photosensitive resin layer to form a conductive pattern.

2. The method for forming a conductive pattern according to claim 1 , wherein a minimum light transmittance in a wavelength range of 450 to 650 nm of a laminate of the conductive layer and the photosensitive resin layer is 80% or higher, provided that a total film thickness of the two layers is set at 1 to 10 μm.

3. The method for forming a conductive pattern according to claim 1 , wherein the conductive fiber is silver fiber.

4. The method for forming a conductive pattern according to claim 1 , wherein the photosensitive resin layer comprises a binder polymer, a photopolymerizable compound having an ethylenic unsaturated bond, and a photopolymerization initiator.

Assignments (3)
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2011
From: YAMAZAKI, HIROSHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 025942/0070 →