IP Library Granted Patent US 10,738,165
Granted Patent B2
US 10,738,165 · App. 16/141,155 · Granted Aug 11, 2020

Aerogel

Inventors: Tomohiko Kotake (Tokyo, JP); Masato Miyatake (Tokyo, JP); Hikari Murai (Tokyo, JP)
Assignee: HITACHI CHEMICAL COMPANY, LTD.
C08G77/14C08J9/283C08L83/06F16L59/028C08J2383/06
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Quick Facts
Patent No.
US 10,738,165
App. No.
16/141,155
Granted
Aug 11, 2020
Kind
B2
Abstract

The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m·K or less and a compressive elasticity modulus of 2 MPa or less at 25° C. under atmospheric pressure.

Claims (14)

1. An aerogel wherein a ratio Q+T:D of a signal area derived from Q and T to a signal area derived from D is from 1:0.01 to 1:0.5 when in a solid 29 Si-NMR spectrum as measured by using DD/MAS method, silicon-containing bonding units of Q, T, and D are defined below:

Q: a silicon-containing bonding unit comprising four oxygen atoms that are bonded to one silicon atom;

T: a silicon-containing bonding unit comprising three oxygen atoms and one hydrogen atom or one mono-valent organic group that are bonded to one silicon atom; and

D: a silicon-containing bonding unit comprising two oxygen atoms and two hydrogen atoms or two mono-valent organic groups that are bonded to one silicon atom,

providing that the organic group is a mono-valent organic group where an atom bonded to a silicon atom is a carbon atom,

the aerogel comprising a ladder type structure including a structure represented by the following general formula (3):

wherein in the formula (3), R 5 , R 6 , R 7 , and R 8 each independently represents an alkyl group or an aryl group; “a” and “c” each independently represents an integer of from 1 to 3.000; and “b” represents an integer of from 5 to 50.

2. The aerogel according to claim 1 , having a thermal conductivity of 0.03 W/m K or less at 25° C. under atmospheric pressure.

3. The aerogel according to claim 1 , having a compressive elasticity modulus of 2 MPa or less at 25° C. under atmospheric pressure.

4. The aerogel according to claim 1 , having a recovery rate from deformation of 90% or more.

5. The aerogel according to claim 1 , having a maximum compressive deformation rate of 80% or more.

6. The aerogel according to claim 1 , further comprising a structure represented by the following general formula (1):

wherein in the formula (I), R 1 and R 2 each independently represents an alkyl group or an aryl group and R 3 and R 4 each independently represents an alkylene group.

7. A heat insulating material comprising the aerogel according to claim 1 .

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2020
From: KOTAKE, TOMOHIKO; MIYATAKE, MASATO; MURAI, HIKARI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052357/0461 →
Priority Claims (2)
JP 2014-035155 · Feb 26, 2014 · national
JP 2015-013371 · Jan 27, 2015 · national
Continuity (2)
Division 15121668
Related Publication 20190023849A1 · Jan 24, 2019