Photosensitive conductive film, conductive pattern formation method using same, and conductive pattern substrate

1. A conductive pattern formation method, comprising:

a step of providing a photosensitive conductive film including a conductive layer containing conductive fibers, a photosensitive resin layer containing a photosensitive resin and an inorganic filler, wherein an average primary particle size of the inorganic filler is 200 nm or less, and a support film in this order, and laminating the conductive layer and the photosensitive resin layer on a base material such that the conductive layer side is closely bonded to the base material; and

a step of exposing and developing the photosensitive resin layer and the conductive layer on the base material to form a conductive pattern on the base material.

2. The conductive pattern formation method according to claim 1 , wherein the inorganic filler contains an inorganic filler having a primary particle size of 1 to 1000 nm.

3. The conductive pattern formation method according to claim 1 , wherein the photosensitive resin layer comprises a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator.

4. The conductive pattern formation method according to claim 3 , wherein the binder polymer has a carboxyl group.

5. The conductive pattern formation method according to claim 1 , wherein a laminate of the conductive layer and the photosensitive resin layer has a minimum light transmittance of 80% or more in the wavelength band of 450 to 650 nm.

6. The conductive pattern formation method according to claim 1 , wherein the conductive pattern comprises the conductive layer including conductive fibers disposed on the base material and a cured portion of the photosensitive resin layer disposed on the conductive layer.

7. A conductive pattern formation method, comprising:

providing a photosensitive conductive film including a conductive layer containing conductive fibers, a photosensitive resin layer containing a photosensitive resin and an inorganic filler, wherein an average primary particle size of the inorganic filler is 200 nm or less, and a support film in this order;

laminating the conductive layer and the photosensitive resin layer on a base material such that the conductive layer is in direct contact with the base material; and

exposing and developing the photosensitive resin layer and the conductive layer on the base material to form a conductive pattern on the base material.

8. (Withdrawn and Currently Amended)The conductive pattern formation method according to claim 7 , wherein the conductive pattern comprises the conductive layer including conductive fibers disposed on the base material and a cured portion of the photosensitive resin layer disposed on the conductive layer.

9. The conductive pattern formation method according to claim 7 , wherein the inorganic filler contains an inorganic filler having a primary particle size of 1 to 1000 nm.

10. The conductive pattern formation method according to claim 9 , wherein the conductive pattern comprises the conductive layer including conductive fibers disposed on the base material and a cured portion of the photosensitive resin layer disposed on the conductive layer.

11. The conductive pattern formation method according to claim 7 , wherein the photosensitive resin layer comprises a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator.

12. The conductive pattern formation method according to claim 11 , wherein the binder polymer has a carboxyl group.

13. The conductive pattern formation method according to claim 7 , wherein a laminate of the conductive layer and the photosensitive resin layer has a minimum light transmittance of 80% or more in the wavelength band of 450 to 650 nm.