Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate

1. A laminate body containing one or more resin composition layers and two or more glass substrate layers, wherein:

at least one layer of those one or more resin composition layers is a fiber-containing resin composition layer of a fiber-containing resin composition that contains a thermosetting resin and a fibrous base material, and

at least one layer of those resin composition layers exists between any two layers of the glass substrate layers.

2. The laminate body according to claim 1 , wherein the thickness of the glass substrate layer is from 30 to 200 μm.

3. The laminate body according to claim 1 , wherein, of those two or more glass substrate layers, the glass substrate layer on the outermost surface side and the glass substrate layer on the outermost back side exist on the more surface side and on the more back side, respectively, than all the resin composition layers.

4. The laminate body according to claim 1 , wherein:

those one or more resin composition layers include a first resin composition layer facing the surface of the glass substrate layer on the outermost surface side, and a second resin composition layer facing the back of the glass substrate layer on the outermost back side, and

the first resin composition layer and the second resin composition layer each are a non-fiber organic composition layer of a non-fiber organic composition that contains a thermosetting resin but does not contain a fibrous base material.

5. The laminate body according to claim 4 , wherein the first resin composition layer and the second resin composition layer each have a thickness of from 3 to 40 μm.

6. The laminate body according to claim 1 , wherein the fiber-containing resin composition layer contains an inorganic filler.

7. The laminate body according to claim 6 , wherein the inorganic filler is one or more selected from silica, alumina, talc, mica, aluminium hydroxide, magnesium hydroxide, calcium carbonate, aluminium borate and borosilicate glass.

8. The laminate body according to claim 1 , wherein the fibrous base material is one or more selected from glass fibers, polyimide fibers, polyester fibers and polytetrafluoroethylene fibers.

9. The laminate body according to claim 1 , wherein the thermosetting resin is one or more selected from an epoxy resin, a phenolic resin, an unsaturated imide resin, a cyanate resin, an isocyanate resin, a benzoxazine resin, an oxetane resin, an amino resin, an unsaturated polyester resin, an allyl resin, a dicyclopentadiene resin, a silicone resin, a triazine resin and a melamine resin.

10. A laminate plate containing one or more cured resin layers and two or more glass substrate layers, wherein:

at least one layer of those one or more cured resin layers is a fiber-containing cured resin layer of a cured product of a fiber-containing resin composition that contains a thermosetting resin and a fibrous base material, and

at least one layer of those cured resin layers exists between any two layers of the glass substrate layers.

11. The laminate plate according to claim 10 , which has a storage elastic modulus at 40° C. of from 10 GPa to 70 GPa.

12. The laminate plate according to claim 10 , which is obtained by heating a laminate body containing one or more resin composition layers and two or more glass substrate layers, wherein:

at least one layer of those one or more resin composition layers is a fiber-containing resin composition layer of the fiber-containing resin composition that contains the thermosetting resin and the fibrous base material, and

at least one layer of those resin composition layers exists between any two layers of the glass substrate layers.

13. A multilayer laminate plate containing multiple laminate plates, wherein:

at least one laminate plate is the laminate plate of claim 10 .

14. A printed wiring board having the laminate plate of claim 10 and a wiring provided on the surface of the laminate plate.

15. A printed wiring board having the multilayer laminate plate of claim 13 and a wiring provided on the surface of the multilayer laminate plate.

16. A method for producing a laminate plate of claim 10 , which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.

17. The method for producing a laminate plate according to claim 16 , wherein the cured resin layer forming step is a step of laminating a film of the resin composition onto the glass substrate by the use of a vacuum laminator or a roll laminator, followed by curing the film.

18. The method for producing a laminate plate according to claim 16 , wherein the cured resin layer forming step is a step of arranging a film of the resin composition onto the glass substrate followed by pressing and curing the film.