Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
An adhesive composition comprising (a) a compound having at least two ethylenically unsaturated groups, (b) a thermal polymerization initiator, (c) a hindered phenolic compound, (d) a thioether compound and (e) a compound having a thiol group.
1. An adhesive composition comprising:
(a) a compound having at least two ethylenically unsaturated groups,
(b) a thermal polymerization initiator,
(c) a hindered phenolic compound,
(d) a thioether compound,
(e) a compound having a thiol group, and
(f) an acrylic polymer having a weight-average molecular weight of 100000 or more,
wherein the acrylic polymer having a weight-average molecular weight of 100000 or more contains a structural unit having an epoxy group.
2. The adhesive composition according to claim 1 , for use in optical parts.
3. A cured-resin product obtained from the adhesive composition according to claim 2 .
4. A method for manufacturing a semiconductor device comprising:
a step of forming an adhesive layer of the adhesive composition according to claim 2 on a semiconductor substrate,
a step of sandwiching the adhesive layer between the semiconductor substrate and a transparent substrate, and applying pressure onto the semiconductor substrate and the transparent substrate for bonding, and
a step of curing the adhesive layer.
5. The adhesive composition according to claim 2 , wherein the compound having at least two ethylenically unsaturated groups includes a urethane-based compound having (meth) acryloyl groups.
6. A cured-resin product obtained from the adhesive composition according to claim 5 .
7. A method for manufacturing a semiconductor device comprising:
a step of forming an adhesive layer of the adhesive composition according to claim 5 on a semiconductor substrate,
a step of sandwiching the adhesive layer between the semiconductor substrate and a transparent substrate, and applying pressure onto the semiconductor substrate and the transparent substrate for bonding, and
a step of curing the adhesive layer.
8. The adhesive composition according to claim 1 , wherein the compound having at least two ethylenically unsaturated groups includes a urethane-based compound having (meth) acryloyl groups.
9. A cured-resin product obtained from the adhesive composition according to claim 8 .
10. A method for manufacturing a semiconductor device comprising:
a step of forming an adhesive layer of the adhesive composition according to claim 8 on a semiconductor substrate,
a step of sandwiching the adhesive layer between the semiconductor substrate and a transparent substrate, and applying pressure onto the semiconductor substrate and the transparent substrate for bonding, and
a step of curing the adhesive layer.
11. A cured-resin product obtained from the adhesive composition according to claim 1 .
12. A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface,
an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and
a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein
the adhesive layer is the cured-resin product according to claim 11 .
13. A method for manufacturing a semiconductor device comprising:
a step of forming an adhesive layer of the adhesive composition according to claim 1 on a semiconductor substrate,
a step of sandwiching the adhesive layer between the semiconductor substrate and a transparent substrate, and applying pressure onto the semiconductor substrate and the transparent substrate for bonding, and
a step of curing the adhesive layer.