Patent Assignment
Reel/Frame 042813/0254
Assignment of Assignor's Interest
Recorded: 2017-06-26
Pages: 3
Assignors
IKEDA, AYA
Executed: 2016-07-29
FUJII, SHINJIRO
Executed: 2016-08-03
KATOU, SADAAKI
Executed: 2016-08-02
HASHIMOTO, SHU
Executed: 2016-08-03
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Adhesive Composition, Resin Cured Product Obtained from Adhesive Composition, Method for Manufacturing Semiconductor Device Using Adhesive Composition, and Solid-State Imaging Element
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →