IP Library Granted Patent US 10,037,894
Granted Patent B2
US 10,037,894 · App. 14/376,382 · Granted Jul 31, 2018

Polishing liquid for metal and polishing method

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Quick Facts
Patent No.
US 10,037,894
App. No.
14/376,382
Granted
Jul 31, 2018
Kind
B2
Abstract

The present invention relates to a metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising, component A: a metal solubilizer containing amino acids, component B: compounds having the benzotriazole skeleton, and component C: an acrylic acid polymer having the weight average molecular weight of 10,000 or more, and having the mass ratio between the component B and the component C, (component B:component C), to be 1:1 to 1:5. Use of the metal polishing liquid can simultaneously yield high polishing rates and low etching rates at higher level, enabling to form an embedded pattern with higher reliability.

Claims (36)

1. A metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising

component A: a metal solubilizer containing an amino acid, wherein the metal solubilizer includes at least one of glycine or α-alanine;

component B: a compound having the benzotriazole skeleton selected from the group consisting of benzotriazole, 1-hydroxybenzotriazole or 5-methyl-1H-benzotriazole;

component C: an acrylic acid polymer comprising polyacrylic acid having the weight average molecular weight of 20,000 or more,

an oxidizing agent containing hydrogen peroxide; and

abrasive grains,

wherein the mass ratio between the component B and the component C, (component B:component C), is 1:1 to 1:5.

2. The metal polishing liquid according to claim 1 , wherein pH is in the range of 2 to 6.

3. A metal polishing liquid according to claim 1 , wherein the metal contains at least one type selected from the group consisting of copper, copper alloys, copper oxides, and oxides of copper alloys.

4. A metal polishing liquid according to claim 1 , wherein a mole ratio of the amino acid in the metal solubilizer is at least 90%.

5. The metal polishing liquid according to claim 1 , wherein the amino acid has a molecular weight of 200 or less.

6. The metal polishing liquid according to claim 1 , wherein the amino acid has a molecular weight of 150 or less.

7. The metal polishing liquid according to claim 1 , wherein the metal solubilizer comprises primary amino acids.

8. The metal polishing liquid according to claim 1 , wherein the metal solubilizer comprises primary amino acids having a molecular weight of 200 or less.

9. The metal polishing liquid according to claim 1 , wherein the metal solubilizer comprises primary amino acids having a molecular weight of 150 or less.

10. The metal polishing liquid according to claim 1 , wherein the metal solubilizer includes glycine, α-alanine, β-alanine (3-aminopropanoic acid), or 4-aminobutyric acid.

11. A polishing method comprising polishing a part of metal in a substrate having the metal, wherein the polishing is performed by using the metal polishing liquid according to claim 1 .

12. A metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising

component A: a metal solubilizer comprising more than 99 mol % of amino acid, wherein the metal solubilizer includes at least one of glycine or α-alanine;

component B: a compound having the benzotriazole skeleton selected from the group consisting of benzotriazole, 1-hydroxybenzotriazole or 5-methyl-1H-benzotriazole;

component C: an acrylic acid polymer comprising polyacrylic acid having the weight average molecular weight of 20,000 or more,

an oxidizing agent containing hydrogen peroxide; and

abrasive grains,

wherein the mass ratio between the component B and the component C, (component B:component C), is 1:1 to 1:5.

13. The metal polishing liquid according to claim 12 , wherein the amino acid has a molecular weight of 200 or less.

14. The metal polishing liquid according to claim 12 , wherein the amino acid has a molecular weight of 150 or less.

15. The metal polishing liquid according to claim 12 , wherein the metal solubilizer comprises primary amino acids.

16. The metal polishing liquid according to claim 12 , wherein the metal solubilizer comprises primary amino acids having a molecular weight of 200 or less.

17. The metal polishing liquid according to claim 12 , wherein the metal solubilizer includes glycine, α-alanine, β-alanine (3-aminopropanoic acid), or 4-aminobutyric acid.

18. A metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising

component A: a metal solubilizer comprising an amino acid and lacking an inorganic acid, wherein the metal solubilizer includes at least one of glycine or α-alanine;

component B: a compound having the benzotriazole skeleton selected from the group consisting of benzotriazole, 1-hydroxybenzotriazole or 5-methyl-1H-benzotriazole;

component C: an acrylic acid polymer comprising polyacrylic acid having the weight average molecular weight of 20,000 or more,

an oxidizing agent containing hydrogen peroxide; and

abrasive grains,

wherein the mass ratio between the component B and the component C, (component B:component C), is 1:1 to 1:5.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2018
From: ICHIGE, YASUHIRO; HAGA, KOUJI; KONDO, SEIICHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 045457/0512 →