Adhesive agent, adhesive material using the same, and method of use thereof

1. An adhesive agent comprising a polyamide resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, the polyamide resin contains an isophthalic acid unit, and meeting at least one of the following (1) and (2):

(1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.; and

(2) the polyamide resin has a polyoxyalkanediyl group;

wherein the polyamide resin contains a dicarboxylic acid unit having a bivalent aromatic ring group, and

the content of the dicarboxylic acid unit having a bivalent aromatic ring group in the polyamide resin is 30 to 50 mol % based on the total amount of the monomer (A) unit and the monomer (B) unit,

wherein the polyamide resin further contains a diamine unit having a 1,4-piperazinediyl group, and

wherein the content of the isophthalic acid unit in the polyamide resin is 87.5-100 mol %, based on the total amount of the isophthalic acid unit and a terephthalic acid unit.

2. The adhesive agent according to claim 1 , meeting both of the (1) and (2).

3. The adhesive agent according to claim 1 , wherein the structural unit in the polyamide resin has the polyoxyalkanediyl group.

4. The adhesive agent according to claim 1 , wherein a structure derived from the monomer (B) in the structural unit has the polyoxyalkanediyl group.

5. The adhesive agent according to claim 1 , wherein the polymerizable monomer contains a monomer (b-1) having a polyoxyalkanediyl group and 2or more amino groups in a proportion of 2.5 to 10 mol % based on the total amount of the monomer (A) and the monomer (B).

6. The adhesive agent according to claim 1 , wherein the content of the polyamide resin is 50 mass % or more.

7. The adhesive agent according to claim 1 , consisting of the polyamide resin.

8. An adhesive agent containing 50 mass % or more of a polyamide resin, the polyamide resin having a polyoxyalkanediyl group;

wherein the polyamide resin contains a dicarboxylic acid unit having a bivalent aromatic ring group, and

wherein the polyamide resin contains an isophthalic acid unit;

the polyamide resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups; and

the content of the dicarboxylic acid unit having a bivalent aromatic ring group in the polyamide resin is 30 to 50 mol % based on the total amount of the monomer (A) unit and the monomer (B) unit,

wherein the polyamide resin further contains a diamine unit having a 1,4-piperazinediyl group, and

wherein the content of the isophthalic acid unit in the polyamide resin is 87.5100 mol %, based on the total amount of the isophthalic acid unit and a terephthalic acid unit.

9. The adhesive agent according to claim 8 , wherein the polyamide resin contains a diamine unit having a polyoxyalkanediyl group.

10. The adhesive agent according to claim 8 , consisting of the polyamide resin.

11. An adhesive material comprising a substrate and an adhesive layer containing the adhesive agent according to claim 1 formed on the substrate.

12. A method of using an adhesive agent comprising:

an application step of applying a second adherend to a first adherend via an adhesive layer containing the adhesive agent according to claim 1 ;

a heating step of heating the first adherend and the second adherend under a condition such that a temperature of the adhesive layer is 200° C. or higher; and

a peeling step of peeling the adhesive layer and the second adherend from the first adherend subjected to the heating step.

13. The method according to claim 12 , wherein the first adherend and the second adherend are applied at 0 to 50° C. in the application step.

14. The method according to claim 12 , wherein the adhesive layer and the second adherend are peeled from the first adherend at 0 to 50° C. in the peeling step.

15. The method according to claim 12 , where in the adhesive layer peeled in the peeling step is reused in the application step.

16. A method of using an adhesive material comprising:

an application step of applying the adhesive material according to claim 11 to an adherend such that the adhesive layer is disposed on the side closer to the adherend;

a heating step of heating the adherend under a condition such that the temperature of the adhesive material is 200° C. or higher; and

a peeling step of peeling the adhesive material from the adherend subjected to the heating step.

17. The method according to claim 16 , wherein the adhesive material is applied to the adherend at 0 to 50° C. in the application step.

18. The method according to claim 16 , wherein the adhesive material is peeled from the adherend at 0 to 50° C. in the peeling step.

19. The method according to claim 16 , wherein the adhesive material peeled in the peeling step is reused in the application step.