Polishing liquid and method for polishing substrate using the polishing liquid
View Patent ↗Provided is a polishing liquid including cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group, and water, wherein the organic acid A has at least one group selected from the group consisting of —COOM group, -Ph-OM group, —SO 3 M group and —PO 3 M 2 group, pKa of the organic acid A is less than 9, a content of the organic acid A is 0.001 to 1 mass % with respect to the total mass of the polishing liquid, and a content of the polymer compound B is 0.01 to 0.50 mass % with respect to the total mass of the polishing liquid, and pH is in the range of 4.0 to 7.0.
1. A polishing liquid for chemical mechanical polishing comprising: cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group, and water,
wherein the organic acid A is p-toluenesulfonic acid,
a content of the organic acid A is 0.001 to 1 mass % with respect to the total mass of the polishing liquid,
a content of the polymer compound B is 0.01 to 0.50 mass % with respect to the total mass of the polishing liquid, and
a pH of the polishing liquid is in the range of 4.0 to 7.0.
2. The polishing liquid according to claim 1 , wherein the polishing liquid is stored as a two liquid-type polishing liquid consisting of a first liquid comprising the cerium oxide particles and the water, and a second liquid comprising the organic acid A, the polymer compound B and the water,
wherein the first liquid and the second liquid are combined prior to use, thereby forming the polishing liquid.
3. The polishing liquid according to claim 2 , wherein the first liquid further comprises a dispersant.
4. The polishing liquid according to claim 1 , wherein the polymer compound B is poly(meth)acrylic acid.
5. A substrate polishing method for polishing a polishing target film formed on a surface of a substrate, the method comprising the steps of:
(a) providing a polishing target film formed on a surface of a substrate;
(b) providing the polishing liquid according to claim 1 ; and
(c) polishing the polishing target film with the polishing liquid according to claim 1 .
6. A substrate polishing method for polishing a polishing target film formed on a surface of a substrate, the method comprising the steps of:
(a) providing a polishing target film formed on a surface of a substrate;
(b) providing the polishing liquid according to claim 2 ; and
(c) polishing the polishing target film with the polishing liquid according to claim 2 .
7. A substrate polishing method for polishing a polishing target film formed on a surface of a substrate, the method comprising the steps of:
(a) providing a polishing target film formed on a surface of a substrate;
(b) providing the polishing liquid according to claim 3 ; and
(c) polishing the polishing target film with the polishing liquid according to claim 3 .