Patent Assignment
Reel/Frame 030397/0124
Assignment of Assignor's Interest
Recorded: 2013-05-10
Pages: 4
Assignors
OOTA, MUNEHIRO
Executed: 2013-04-08
TANAKA, TAKAAKI
Executed: 2013-04-08
TAKIZAWA, TOSHIO
Executed: 2013-04-08
YOSHIKAWA, SHIGERU
Executed: 2013-04-08
MATSUMOTO, TAKAAKI
Executed: 2013-04-08
YOSHIKAWA, TAKAHIRO
Executed: 2013-04-08
SHINODA, TAKASHI
Executed: 2013-04-10
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Polishing Liquid and Method for Polishing Substrate Using the Polishing Liquid
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →