Compound and tablet
A compound comprises a resin composition containing an epoxy resin, a phenol resin, a wax, and an imidazole compound, and a metal element-containing powder, wherein the epoxy resin comprises a crystalline epoxy resin, the wax comprises a montanic acid ester, and the content of the metal element-containing powder is 90 mass % or more based on the total mass of the compound.
1. A compound comprising:
a resin composition comprising an epoxy resin, a phenol resin, a wax, and an imidazole compound; and
a metal element-containing powder,
wherein the epoxy resin comprises a crystalline epoxy resin,
wherein a content of the wax is 0.3 to 1.2 mass % based on the total mass of the compound, and the wax comprises a montanic acid ester, and
wherein a content of the metal element-containing powder is 90 mass % or more based on the total mass of the compound.
2. The compound according to claim 1 , wherein the crystalline epoxy resin comprises at least one selected from the group consisting of a biphenyl-type epoxy resin and a biphenyl aralkyl-type epoxy resin.
3. The compound according to claim 1 , wherein the metal element-containing powder comprises an amorphous Fe alloy powder.
4. The compound according to claim 1 , wherein the imidazole compound comprises an imidazole compound having an alkyl group with 8 or more carbon atoms.
5. The compound according to claim 1 , wherein the content of the wax is 0.4 to 1.0 mass % based on the total mass of the compound.
6. The compound according to claim 1 , wherein the content of the wax is 0.5 to 0.9 mass % based on the total mass of the compound.
7. The compound according to claim 1 , wherein the content of the metal element-containing powder is 92 mass % or more based on the total mass of the compound.
8. The compound according to claim 1 , wherein the content of the metal element-containing powder is 94 mass % or more based on the total mass of the compound.
9. The compound according to claim 1 , wherein the content of the metal element-containing powder is 90 mass % or more and 99.8 mass % or less based on the total mass of the compound.
10. The compound according to claim 1 , wherein the content of the metal element-containing powder is 98 mass % or less based on the total mass of the compound.
11. The compound according to claim 1 , wherein the content of the metal element-containing powder is 96 mass % or less based on the total mass of the compound.
12. The compound according to claim 1 , wherein the crystalline epoxy resin comprises at least one selected from the group consisting of a biphenyl-type epoxy resin and a biphenyl aralkyl-type epoxy resin, the metal element-containing powder comprises an amorphous Fe alloy powder, and the imidazole compound comprises an imidazole compound having an alkyl group with 8 or more carbon atoms.
13. The compound according to claim 1 , wherein the compound is used for an inductor.
14. The compound according to claim 1 , wherein the compound is used for transfer molding.
15. A tablet formed by using the compound according to claim 1 .