CMP polishing compound and polishing method
View Patent ↗The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and α-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefor easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.
1. A CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer wherein the added amount of the water-soluble polymer is 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry, and water,
wherein the water-soluble polymer is a polymer containing a structural unit made of at least one polymerizable monomer selected from the group consisting of the following general formula (I):
wherein R 1 represents hydrogen, a methyl group, a phenyl group, a benzyl group, a chloro group, a difluoromethyl group, a trifluoromethyl group, or a cyano group; and R 2 and R 3 each independently represent hydrogen, an alkyl chain of C 1 to C 18 , a methylol group, or an acetyl group provided that the case that both of R 2 and R 3 are hydrogen is excluded.
2. A polishing method for polishing a film to be polished, wherein a substrate on which the film is formed is pushed against a polishing cloth of a polishing table, pressure is applied to the substrate, and then at least one of the substrate and the polishing table are moved while the CMP polishing slurry according to claim 1 is supplied between the film and the polishing cloth.
3. The CMP polishing slurry according to claim 1 , wherein the dispersing agent is at least one selected from a polymeric dispersing agent containing an ammonium salt of acrylic acid as a polymerizable monomer component, water-soluble anionic dispersing agents, water-soluble non-ionic dispersing agents, water-soluble cationic dispersing agents, and water-soluble amphoteric dispersing agents.
4. The CMP polishing slurry according to claim 1 , wherein the dispersing agent contains at least polymeric dispersing agent containing an ammonium salt of acrylic acid as a polymerizable monomer component.
5. The CMP polishing slurry according to claim 1 , wherein the amount of the dispersing agent is 0.01 parts or more by weight and 2.0 or less parts by weight for 100 parts by weight of the cerium oxide particles.
6. A CMP polishing slurry, comprising cerium oxide particles, a dispersing agent a water-soluble polymer wherein the added amount of the water-soluble polymer is 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry, and water,
wherein the concentration of the cerium oxide particles in the CMP polishing slurry is within the range of 0.5% by weight or more to 20% by weight or less,
wherein the water-soluble polymer is a polymer containing a structural unit made of at least one polymerizable monomer selected from the group consisting of the following general formula (I):
wherein R 1 represents hydrogen, a methyl group, a phenyl group, a benzyl group, a chloro group, a difluoromethyl group, a trifluoromethyl group, or a cyano group; and R 2 and R 3 each independently represent hydrogen, an alkyl chain of C 1 to C 18 , a methylol group, or an acetyl group provided that the case that both of R 2 and R 3 are hydrogen is excluded.
7. The CMP polishing slurry according to claim 6 , wherein the dispersing agent is at least one selected from a polymeric dispersing agent containing an ammonium salt of acrylic acid as a polymerizable monomer component, water-soluble anionic dispersing agents, and water-soluble non-ionic dispersing agents, water-soluble cationic dispersing agents, and water-soluble amphoteric dispersing agents.
8. The CMP polishing slurry according to claim 6 , wherein the dispersing agent contains at least polymeric dispersing agent containing an ammonium salt of acrylic acid as a polymerizable monomer component.
9. The CMP polishing slurry according to claim 6 , wherein the amount of the dispersing agents is 0.01 part or more by weight and 2.0 or less parts by weight for 100 parts by weight of the cerium oxide particles.