Patent Assignment
Reel/Frame 017566/0744
Assignment of Assignor's Interest
Recorded: 2005-07-29
Pages: 3
Assignors
FUKASAWA, MASATO
Executed: 2005-07-21
YOSHIDA, MASATO
Executed: 2005-07-21
KOYAMA, NAOYUKI
Executed: 2005-07-21
OOTSUKI, YUTO
Executed: 2005-07-21
YAMAGISHI, CHIAKI
Executed: 2005-07-21
ENOMOTO, KAZUHIRO
Executed: 2005-07-21
HAGA, KOUJI
Executed: 2005-07-21
KURATA, YASUSHI
Executed: 2005-07-21
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Cmp Polishing Compound and Polishing Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →