IP Library Granted Patent US 10,717,893
Granted Patent B2
US 10,717,893 · App. 15/985,948 · Granted Jul 21, 2020

Photosensitive film, photosensitive element, cured product and touch panel

Inventors: Mayumi Sato (Tokyo, JP); Koji Abe (Tokyo, JP); Hideo Takahashi (Tokyo, JP)
Assignee: HITACHI CHEMICAL COMPANY, LTD.
C09D133/12C09D4/00G06F3/044G06F2203/04103G06F2203/04111Y10T428/24802
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Quick Facts
Patent No.
US 10,717,893
App. No.
15/985,948
Granted
Jul 21, 2020
Kind
B2
Abstract

A mobile phone including a touch panel including a base material; a sensing region including at least one electrode provided over the base material; and a frame region provided at a periphery of the sensing region, the frame region including metal wiring provided over the base material and being electrically connected to the at least one electrode; and a cured product of a photosensitive resin composition disposed at least on the metal wiring, the photosensitive resin composition contains a component (A): a binder polymer, a component (B): a photopolymerizable compound, and a component (C): a photopolymerization initiator; and the component (B) includes a di(meth)acrylate compound having at least one selected from the group consisting of a dicyclopentanyl structure and a dicyclopentenyl structure.

Claims (27)

1. A mobile phone comprising a touch panel,

the touch panel comprising a base material; a sensing region including at least one electrode provided over the base material; and a frame region provided at a periphery of the sensing region, the frame region including metal wiring provided over the base material and being electrically connected to the at least one electrode; and a cured product of a photosensitive resin composition disposed at least on the metal wiring,

wherein the photosensitive resin composition contains a component (A): a binder polymer, a component (B): a photopolymerizable compound, and a component (C): a photopolymerization initiator; and

the component (B) includes a di(meth)acrylate compound having at least one selected from the group consisting of a dicyclopentanyl structure and a dicyclopentenyl structure.

2. The mobile phone according to claim 1 , wherein the di(meth)acrylate compound is a compound represented by the following general formula (1):

wherein in the general formula (1), X represents a dicyclopentanyl structure or a dicyclopentenyl structure; R each independently represents an alkylene group having 1 to 4 carbon atoms; R 1 and R 2 each independently represent a hydrogen atom or a methyl group; and n and m each independently represent 0 to 2; and p+q is 0 to 10.

3. The mobile phone according to claim 1 , wherein the di(meth)acrylate compound includes at least one compound selected from the group consisting of dimethylol tricyclodecane di(meth)acrylate and tricyclodecanediol di(meth)acrylate.

4. The mobile phone according to claim 1 , wherein the photosensitive resin composition further contains at least one compound selected from the group consisting of a triazole compound, a thiadiazole compound and a tetrazole compound.

5. The mobile phone according to claim 1 , wherein the component (C) includes an oxime ester compound.

6. The mobile phone according to claim 5 , wherein the oxime ester compound includes a compound represented by the general formula (2) below:

wherein, in the general formula (2), R and R 1 each represent an alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, a phenyl group or a tolyl group, and R 2 represents non-substitution, OH, COOH, O(CH 2 )OH, O(CH 2 ) 2 OH, COO(CH 2 )OH or COO(CH 2 ) 2 OH.

7. The mobile phone according to claim 5 , wherein the oxime ester compound includes a compound represented by the general formula (3) below:

wherein, in the general formula (3), R 3 represents an alkyl group having 1 to 6 carbon atom, R 4 represents NO 2 or ArCO, Ar represents an aryl group, R 5 and R 6 each represent an alkyl group having 1 to 12 carbon atoms, a phenyl group or a tolyl group.

8. The mobile phone according to claim 5 , wherein the oxime ester compound includes a compound represented by the general formula (4) below:

wherein, in the general formula (4), R 7 represents an alkyl group having 1 to 6 carbon atoms, R 8 is an organic group having an acetal bond, R 9 and R 10 are each an alkyl group having 1 to 12 carbon atoms, a phenyl group or a tolyl group.

9. The mobile phone according to claim 5 , wherein the component (C) further includes an aromatic ketone.

10. The mobile phone according to claim 1 , wherein the component (A) includes a copolymer having a constituent unit derived from (meth)acrylic acid, and a constituent unit derived from alkyl (meth)acrylate.

11. The mobile phone according to claim 1 , wherein acid value of the component (A) is 75 mgKOH/g or more.

12. The mobile phone according to claim 1 , wherein the component (B) further includes a polyfunctional vinyl monomer having three or more ethylenically unsaturated groups.

13. The mobile phone according to claim 12 , wherein a proportion of the polyfunctional vinyl monomer having three or more ethylenically unsaturated groups is 10 parts by mass or more with respect to 100 parts by mass of the component (B).

14. The mobile phone according to claim 1 , wherein a content of the component (A) is 35 to 85 parts by mass and a content of the component (B) is 15 to 65 parts by mass with respect to 100 parts by mass of a total amount of the component (A) and the component (B).

15. The mobile phone according to claim 1 , wherein a content of the component (C) is 0.1 to 20 parts by mass with respect to 100 parts by mass of a total amount of the component (A) and the component (B).

16. The mobile phone according to claim 1 , wherein the photosensitive resin composition further contains a tetrazole compound.

17. The mobile phone according to claim 1 , wherein the photosensitive resin composition further contains a phosphoric acid ester having a photopolymerizable unsaturated bond.

18. The mobile phone according to claim 1 , wherein a thickness of the cured product is 10 μm or less.

19. The mobile phone according to claim 1 , wherein a thickness of the cured product is 9 μm or less.

20. The mobile phone according to claim 1 , wherein the metal wiring has an ITO electrode, and a copper layer formed on the ITO electrode.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2020
From: SATO, MAYUMI; ABE, KOJI; TAKAHASHI, HIDEO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 051898/0239 →
Continuity (2)
Continuation 14934360 · Nov 6, 2015
Related Publication 20180265732A1 · Sep 20, 2018