CMP fluid and method for polishing palladium
The CMP polishing liquid for polishing palladium of this invention comprises an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive. The substrate polishing method is a method for polishing a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, wherein the substrate is a substrate with a palladium layer on the side facing the polishing cloth, and the CMP polishing liquid is a CMP polishing liquid comprising an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive.
1. A polishing method for a substrate, the method comprising:
polishing a palladium layer on a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, wherein:
the CMP polishing liquid comprises an organic solvent, 1,2,4-triazole in an amount ranging from 0.01 to 20 mass %, phosphoric acid in an amount ranging from 0.001 to 20 mass %, hydrogen peroxide in an amount ranging from 0.05 to 20 mass %, and an abrasive, all amounts being based on a total mass of the CMP polishing liquid, and the organic solvent comprises at least one kind selected from among an alcohol, a carbonic acid ester, a carboxylic acid ester and a glycol derivative.
2. The polishing method according to claim 1 , wherein the organic solvent comprises a reducing organic solvent, and the CMP polishing liquid further comprises at least one kind selected from among an amino acid and an organic acid with no primary hydroxyl groups.
3. The polishing method according to claim 2 , wherein the organic acid comprises a carboxylic acid.
4. The polishing method according to claim 2 , wherein the amino acid comprises at least one kind selected from among glycine, alanine, arginine, isoleucine, leucine, valine, phenylalanine, asparagine, glutamine, lysine, histidine, proline, tryptophan, aspartic acid, glutamic acid, serine, threonine, tyrosine, cysteine, methionine, and derivatives of the foregoing.
5. The polishing method according to claim 1 , wherein the abrasive comprises at least one kind selected from among alumina, silica, zirconia, titania and ceria, as the abrasive.
6. The polishing method according to claim 1 , wherein the CMP polishing liquid further comprises a water-soluble polymer.
7. The polishing method according to claim 6 , wherein the water-soluble polymer has a weight-average molecular weight of at least 500.
8. The polishing method according to claim 1 , wherein the CMP polishing liquid comprises the organic solvent in an amount ranging from 0.1 to 95 mass % based on the total mass of the CMP polishing liquid.
9. The polishing method according to claim 8 , wherein the CMP polishing liquid comprises the abrasive in an amount ranging from 0.1 to 10 mass % based on the total mass of the CMP polishing liquid.
10. The polishing method according to claim 9 , wherein the CMP polishing liquid has a pH ranging from 1 to 6.
11. The polishing method according to claim 1 , wherein the organic solvent is included in the amount so as to dissolve palladium-containing compounds in the organic solvent and avoid their adhesion onto the polishing cloth.
12. A polishing method for a substrate, the method comprising: polishing a palladium layer on a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, wherein:
the CMP polishing liquid comprises an organic solvent, an organic acid with no primary hydroxyl group in an amount ranging from 0.1 to 20 mass %, 1,2,4-triazole in an amount ranging from 0.01 to 20 mass %, phosphoric acid in an amount ranging from 0.001 to 20 mass %, hydrogen peroxide in an amount ranging from 0.05 to 20 mass %, and an abrasive, all amounts being based on a total mass of the CMP polishing liquid, and the organic solvent comprises at least one kind selected from among a glycol, a glycol derivative and an alcohol.
13. The polishing method according to claim 12 , wherein the organic acid comprises a carboxylic acid.
14. The polishing method according to claim 12 , wherein the abrasive comprises at least one kind selected from among alumina, silica, zirconia, titania and ceria, as the abrasive.
15. The polishing method according to claim 12 , wherein the CMP polishing liquid comprises the organic solvent in an amount ranging from 0.1 to 95 based on the total mass of the CMP polishing liquid.
16. The polishing method according to claim 15 , wherein the CMP polishing liquid comprises the abrasive in an amount ranging from 0.1 to 10 mass % based on the total mass of the CMP polishing liquid.
17. The polishing method according to claim 16 , wherein the CMP polishing liquid has a pH ranging from 1 to 6.
18. The polishing method according to claim 12 , wherein the organic solvent is included in the amount so as to dissolve palladium-containing compounds in the organic solvent and avoid their adhesion onto the polishing cloth.