Patent Assignment
Reel/Frame 027361/0208
Assignment of Assignor's Interest
Recorded: 2011-12-09
Pages: 4
Assignors
MINAMI, HISATAKA
Executed: 2011-11-15
SAISYO, RYOUTA
Executed: 2011-11-24
AMANOKURA, JIN
Executed: 2011-11-15
OKADA, YUUHEI
Executed: 2011-11-15
ONO, HIROSHI
Executed: 2011-11-11
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
CMP Fluid and Method for Polishing Palladium
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Jun 4, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052836/0544 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →