Patent Assignment
Reel/Frame 052836/0544
Change of Address
Recorded: 2020-06-04
Pages: 2
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
CMP Fluid and Method for Polishing Palladium
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 9, 2011
From: MINAMI, HISATAKA; SAISYO, RYOUTA; AMANOKURA, JIN; OKADA, YUUHEI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 027361/0208 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →