IP Library Granted Patent US 9,786,576
Granted Patent B2
US 9,786,576 · App. 12/741,854 · Granted Oct 10, 2017

Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device

Inventors: Hiroshi Matsutani (Hitachi, JP); Takumi Ueno (Hitachi, JP); Alexandre Nicolas (Hitachi, JP); Ken Nanaumi (Chikusei, JP)
Assignee: HITACHI CHEMICAL COMPANY, LTD
H01L23/3171G03F7/0236G03F7/40H01L23/3114H01L24/13H01L2224/05001H01L2224/056H01L2224/05008H01L2224/05022H01L2224/05024H01L2224/05124H01L2224/05572H01L2924/10253H01L2924/15788H01L2924/181Y10T428/24479
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Quick Facts
Patent No.
US 9,786,576
App. No.
12/741,854
Granted
Oct 10, 2017
Kind
B2
Abstract

A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.

Claims (26)

1. A positive-type photosensitive resin composition comprising:

a phenol resin modified by a drying oil, wherein the drying oil has an iodine number of not less than 130, and the drying oil includes an ester of at least one saturated fatty acid including 8 to 30 carbon atoms with glycerol;

a photo acid generator;

a thermal crosslinking agent; and

a solvent,

wherein the phenol resin modified by the drying oil obtained by

(i) a polycondensation reaction of (a) a reaction product of at least phenol or a derivative thereof and the drying oil with (b) aldehydes, or

(ii) reacting (a) a phenol resin, which is produced by a polycondensation reaction of phenol or a derivative thereof with aldehydes, with (b) the drying oil.

2. The positive-type photosensitive resin composition according to claim 1 , wherein the photo acid generator is an o-quinone diazide compound.

3. The positive-type photosensitive resin composition according to claim 1 , containing 3 to 100 parts by mass of the photo acid generator based on 100 parts by mass of the phenol resin modified by the drying oil.

4. The positive-type photosensitive resin composition according to claim 1 , further comprising an elastomer.

5. The positive-type photosensitive resin composition according to claim 1 , wherein the phenol resin modified by the drying oil is obtained by (i) a polycondensation reaction of (a) a reaction product of at least phenol or a derivative thereof and the drying oil with (b) aldehydes.

6. The positive-type photosensitive resin composition according to claim 5 , wherein the ester has 2-30 unsaturated bonds.

7. The positive-type photosensitive resin composition according to claim 1 , wherein in (i), the phenol resin modified by the drying oil is by combining (a) a compound obtained by reacting phenol or a derivative thereof and the drying oil with a compound other than phenol, and then polycondensing with (b) aldehydes.

8. The positive-type photosensitive resin composition according to claim 1 , wherein the phenol resin modified by the drying oil is obtained by (ii) reacting (a) a phenol resin, which is produced by a polycondensation reaction of phenol or a derivative thereof with aldehydes, with (b) the drying oil.

9. The positive-type photosensitive resin composition according to claim 1 , wherein the phenol resin modified by the drying oil is obtained by (ii) reacting (a) a phenol resin, which is produced by a polycondensation reaction of phenol or a derivative thereof with aldehydes, with (b) the drying oil, and the phenol resin modified by the drying oil is acid-modified by reacting the phenol resin modified by the drying oil with a polybasic acid anhydride.

10. The positive-type photosensitive resin composition according to claim 1 , wherein the thermal crosslinking agent includes at least one compound selected from the group consisting of a compound having a phenolic hydroxyl group, a compound having a hydroxyl methylamino group, and a compound having an epoxy group.

11. A positive-type photosensitive resin composition comprising:

a modified phenol resin;

a photo acid generator;

a thermal crosslinking agent; and

a solvent,

wherein the modified phenol resin is obtained by

(i) a polycondensation reaction of (a) a reaction product of at least phenol or a derivative thereof and an ester with (b) aldehydes, or

(ii) reacting (a) a phenol resin, which is produced by a polycondensation reaction of phenol or a derivative thereof with aldehydes, with (b) an ester,

wherein the ester is an ester of at least one unsaturated fatty acid including 8 to 30 carbon atoms with a monohydric, dihydric, or trihydric alcohol including 1 to 10 carbon atoms.

Assignments (5)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
CHANGE OF ADDRESS Recorded Jun 13, 2017
From: HITACHI CHEMICAL COMPANY, LTD
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 042776/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2011
From: MATSUTANI, HIROSHI; UENO, TAKUMI; NICOLAS, ALEXANDRE; NANAUMI, KEN
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 026492/0744 →
Priority Claims (1)
JP 2007-293631 · Nov 12, 2007 · national
Continuity (1)
Related Publication 20110250396A1 · Oct 13, 2011