Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate
View Patent ↗A photosensitive conductive film 10 according to the invention includes a support film 1 , a conductive layer 2 containing conductive fiber formed on the support film 1 , and a photosensitive resin layer 3 formed on the conductive layer 2.
1. A conductive film substrate comprising a substrate and a conductive pattern formed on the substrate,
wherein said conductive pattern is a conductive pattern that has been formed by a method for forming a conductive pattern comprising:
a step of laminating a photosensitive conductive film comprising a support film, a conductive layer containing conductive fiber formed on the support film, and a photosensitive resin layer formed on the conductive layer so that the photosensitive resin layer is tightly attached onto a substrate;
an exposure step of irradiating a predetermined part of the photosensitive resin layer on the substrate with actinic light; and
a development step of developing the exposed photosensitive resin layer to form a conductive pattern.
2. The conductive film substrate according to claim 1 , wherein a surface resistivity of the conductive pattern is 2000 Ω/square or less.
3. The conductive film substrate according to claim 1 , wherein a minimum light transmittance in a wavelength range of 450 to 650 nm of a laminate of the conductive layer and the photosensitive resin layer is 80% or higher, provided that a total film thickness of the two layers is set at 1 to 10 μm.
4. The conductive film substrate according to claim 1 , wherein the conductive fiber is silver fiber.
5. The conductive film substrate according to claim 1 , wherein the photosensitive resin layer comprises a binder polymer, a photopolymerizable compound having an ethylenic unsaturated bond, and a photopolymerization initiator.
6. The conductive film substrate according to claim 2 , wherein a minimum light transmittance in a wavelength range of 450 to 650 nm of a laminate of the conductive layer and the photosensitive resin layer is 80% or higher, provided that a total film thickness of the two layers is set at 1 to 10 μm.
7. The conductive film substrate according to claim 2 , wherein the conductive fiber is silver fiber.
8. The conductive film substrate according to claim 2 , wherein the photosensitive resin layer comprises a binder polymer, a photopolymerizable compound having an ethylenic unsaturated bond, and a photopolymerization initiator.