Organic interposer and method for manufacturing organic interposer
There are provided an organic interposer capable of improving insulation reliability and a method for manufacturing the organic interposer. An organic interposer 10 is provided with: an organic insulating laminate 12 comprising a plurality of organic insulating layers; and a plurality of wires 13 arranged in the organic insulating laminate 12 , and each of the wires 13 and each of the organic insulating layers are separated by a barrier metal film 14 . The organic insulating laminate 12 may include: a first organic insulating layer 21 having a plurality of grooves 21 a each having each of the wires 13 disposed therein; and a second organic insulating layer 22 laminated to the first organic insulating layer 21 in such a way as to embed the wires 13.
1. A method for manufacturing an organic interposer, the method comprising:
forming a plurality of grooves in a first organic insulating layer;
forming a first barrier metal film on the first organic insulating layer, wherein forming the first barrier metal film on the first organic insulating layer comprises covering an inner surface of each of the grooves and an upper surface of the first organic insulating layer;
forming a wiring layer on the first barrier metal film in such a way as to embed the grooves;
thinning the wiring layer, wherein thinning the wiring layer comprises removing a part of the first barrier metal film located on the upper surface of the first organic insulating layer to expose the upper surface of the first organic insulating layer;
forming a second barrier metal film in such a way as to cover the wiring layer in the grooves;
forming a second organic insulating layer on the first organic insulating layer and on the second barrier metal film; and
forming a wire in an opening of the second organic insulating layer, the wire being in contact with both of the first barrier metal film and the second barrier metal film.
2. The method for manufacturing an organic interposer according to claim 1 , wherein forming the wiring layer comprises a plating method using the first barrier metal film as a seed layer.
3. The method for manufacturing an organic interposer according to claim 1 , wherein forming the second barrier metal film comprises a plating method using the wiring layer as a seed layer.
4. The method for manufacturing an organic interposer according to claim 3 , wherein
thinning the wiring layer further comprises removing a part of the wiring layer in each of the grooves, and
forming the second barrier metal film comprises embedding the second barrier metal film in the grooves.
5. The method for manufacturing an organic interposer according to claim 1 , wherein at least one of the wire, the first barrier metal film and the second barrier metal film has a multi-layer structure.
6. The method for manufacturing an organic interposer according to claim 1 , wherein the second barrier metal film is formed of a palladium-plated film.