EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
An epoxy resin composition includes an epoxy resin; a curing agent; alumina particles; and a silane compound which does not have a functional group that is reactive with an epoxy group and which has a functional group that is unreactive with an epoxy group, wherein the silane compound has a structure in which the functional group that is unreactive with an epoxy resin is bound to a silicon atom, or is bound to a silicon atom via a chain hydrocarbon group having 1 to 5 carbon atoms.
1 . An epoxy resin composition, comprising:
an epoxy resin;
a curing agent;
alumina particles; and
a silane compound which does not have a functional group that is reactive with an epoxy group and which has a functional group that is unreactive with an epoxy group, wherein the silane compound has a structure in which the functional group that is unreactive with an epoxy resin is bound to a silicon atom, or is bound to a silicon atom via a chain hydrocarbon group having 1 to 5 carbon atoms.
2 . The epoxy resin composition according to claim 1 , wherein a content of the silane compound is from 0.01% by mass to 20% by mass with respect to a total amount of the epoxy resin.
3 . The epoxy resin composition according to claim 1 , wherein the functional group that is unreactive with an epoxy resin is at least one selected from the group consisting of a (meth)acryloyl group, a (meth)acryloyloxy group, and a vinyl group.
4 . The epoxy resin composition according to claim 1 , wherein the silane compound comprises 3-methacryloxypropyltrimethoxysilane.
5 . The epoxy resin composition according to claim 1 , wherein a content of the alumina particles is 50% by volume or more with respect to a total amount of the epoxy resin composition.
6 . The epoxy resin composition according to claim 1 , further comprising silica particles.
7 . An electronic component device, having an element sealed with the epoxy resin composition according to claim 1 .