IP Library Granted Patent US 9,709,887
Granted Patent B2
US 9,709,887 · App. 15/125,879 · Granted Jul 18, 2017

Photosensitive conductive film

Inventors: Emiko Oota (Tokyo, JP); Masahiko Ebihara (Tokyo, JP); Yasuharu Murakami (Tokyo, JP)
Assignee: HITACHI CHEMICAL COMPANY, LTD.
G03F7/0047G03F7/027G03F7/031G03F7/033G06F3/044G06F2203/04103
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Quick Facts
Patent No.
US 9,709,887
App. No.
15/125,879
Granted
Jul 18, 2017
Kind
B2
Abstract

A photosensitive conductive film includes: a support film; and a photosensitive layer which is provided on the support film, wherein the photosensitive layer contains a plurality of conductive fibers, and an average value of the shortest distances between each of the conductive fibers and the surface at the side of the support film of the photosensitive layer is 0.1 to 50 nm.

Claims (16)

1. A photosensitive conductive film, comprising:

a support film; and

a photosensitive layer provided on the support film, wherein

the photosensitive layer contains a plurality of conductive fibers, and

an average value of shortest distances between each of the conductive fibers and a surface at the side of the support film of the photosensitive layer is 0.1 to 50 nm.

2. The photosensitive conductive film according to claim 1 , wherein the conductive fiber is a silver fiber.

3. The photosensitive conductive film according to claim 1 , wherein a fiber diameter of the conductive fiber is 1 to 50 nm.

4. The photosensitive conductive film according to claim 1 , wherein a fiber length of the conductive fiber is 1 to 100 μm.

5. The photosensitive conductive film according to claim 1 , wherein

the photosensitive layer contains a photopolymerizable compound having an ethylenically unsaturated bond, and

a hydroxyl value of the photopolymerizable compound is 90 mgKOH/g or less.

6. The photosensitive conductive film according to claim 1 , wherein

the photosensitive layer contains a photopolymerizable compound having an ethylenically unsaturated bond, and

a critical surface tension of the photopolymerizable compound is 47 mN/m or less.

7. The photosensitive conductive film according to claim 1 , wherein the photosensitive layer contains at least one selected from the group consisting of trimethylolpropane tri(meth)acrylate, ethylene oxide-containing trimethylolpropane tri(meth)acrylate, propylene oxide-containing trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate and dipentaerythritol hexa(meth)acrylate.

8. The photosensitive conductive film according to claim 7 , wherein the photosensitive layer contains trimethylolpropane tri(meth)acrylate.

Assignments (3)
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2016
From: OOTA, EMIKO; EBIHARA, MASAHIKO; MURAKAMI, YASUHORU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 039721/0434 →
Priority Claims (1)
JP 2014-051702 · Mar 14, 2014 · national
Continuity (1)
Related Publication 20170003588A1 · Jan 5, 2017