IP Library Granted Patent US 9,464,683
Granted Patent B2
US 9,464,683 · App. 13/819,729 · Granted Oct 11, 2016

Non-asbestos friction-material composition, and friction material and friction member using same

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Quick Facts
Patent No.
US 9,464,683
App. No.
13/819,729
Granted
Oct 11, 2016
Kind
B2
Abstract

A non-asbestos frictional material composition is provided, which is capable of provide a frictional material with excellent shear strength, anti-crack properties, and abrasion resistance, even with the reduced content of copper. Furthermore, a frictional material and a friction member formed by using this non-asbestos frictional material composition are provided. The non-asbestos frictional material composition containing a binder, an organic filler, an inorganic filler, and a fiber base material includes: copper in a content of 0.5 mass % or less as a copper element; a metal other than copper and copper alloy in a content of 0.5 mass % or less; an acrylic elastomer-dispersed phenol resin as the binder in a content of 7-15 mass %; and Ca(OH) 2 and/or CaO as the inorganic filler in a content of 1-5 mass %.

Claims (13)

1. A non-asbestos frictional material composition containing:

a binder comprising an acrylic elastomer-dispersed phenol resin in an amount of 7-15 mass %;

an organic filler;

an inorganic filler comprising at least one of CaO and Ca(OH) 2 in an amount of 1-5 mass %; and

a fiber base material comprising copper in an amount of 0.5 mass % or less as a copper element and a metal other than copper and copper alloy in an amount of 0.5 mass % or less.

2. A friction member being formed from a frictional material formed from the non-asbestos frictional material composition according to claim 1 and a backing plate.

3. A frictional material comprising:

a molded shape; and

a composition comprising:

an acrylic elastomer-dispersed phenol resin in an amount of 7-15 mass %;

an organic filler;

an inorganic filler comprising at least one of CaO and Ca(OH) 2 in an amount of 1-5 mass %; and

a fiber base material comprising copper in an amount of 0.5 mass % or less as a copper element and a metal other than copper and copper alloy in an amount of 0.5 mass % or less.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 10, 2013
From: BABA, KAZUYA; UNNO, MITSUO; KIKUDOME, TAKASHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 030393/0635 →