Low softening point glass composition, bonding material using same and electronic parts

1. A low softening point glass composition, which is substantially free from lead, bismuth and antimony, and comprises oxides of vanadium, phosphorous, tellurium, barium, tungsten and/or molybdenum, and iron and/or alkali metal, the softening point of the glass composition being 380° C. or lower.

2. The low softening point glass composition according to claim 1 , wherein vanadium, phosphorous, tellurium, barium, tungsten, molybdenum, iron, alkali metal are contained in conversion as oxides, an amount of V 2 O 5 being in 40 to 55% by weight, P 2 O 5 in 5 to 15% by weight, TeO 2 in 20 to 30% by weight, BaO in 2 to 10% by weight, WO 3 in 0 to 15% by weight, MoO 3 in 0 to 15% by weight, Fe 2 O 3 in 0 to 8% by weight, R 2 O (R; alkali metal) in 0 to 5% by weight, a total amount of P 2 O 5 and TeO 2 being 30 to 40% by weight, a total amount of WO 3 and MoO 3 being 5 to 15% by weight, and a total amount of Fe 2 O 3 and R 2 O being 2 to 8% by weight.

3. The low softening point glass composition according to claim 1 , wherein the softening point of the glass composition is 360° C. or lower, and a thermal expansion coefficient of the glass composition over a temperature range of 25 to 250° C. is 120×10 −7 /° C. or lower.

4. An electronic part comprising an electronic component having an electrode, in contact with the electronic component, the electrode comprising metal and glass, wherein the glass is the low softening glass composition of claim 2 .

5. The electronic part according to claim 4 , wherein the electronic component is an image display.

6. The electronic part according to claim 4 , wherein the electronic component is a solar cell.