Patent Assignment
Reel/Frame 031163/0028
Assignment of Assignor's Interest
Recorded: 2013-09-09
Pages: 3
Assignor
HITACHI POWDERED METALS CO., LTD.
Executed: 2013-08-27
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2 MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Properties
(2)
Low Softening Point Glass Composition, Bonding Material Using Same and Electronic Parts
Low Softening Point Glass Composition, Bonding Material Using Same and Electronic Parts
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 14, 2010
From: NAITO, TAKASHI; TACHIZONO, SHINICHI; YOSHIMURA, KEI; HASHIBA, YUJI
To: HITACHI POWDERED METALS CO., LTD.
Reel/Frame 023780/0300 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →