Patent Assignment
Reel/Frame 023780/0300
Assignment of Assignor's Interest
Recorded: 2010-01-14
Pages: 3
Assignors
NAITO, TAKASHI
Executed: 2009-12-17
TACHIZONO, SHINICHI
Executed: 2009-12-23
YOSHIMURA, KEI
Executed: 2009-12-23
HASHIBA, YUJI
Executed: 2009-12-23
KANAZAWA, KEIICHI
Executed: 2009-12-21
YAMADA, SHINJI
Executed: 2009-12-25
AMOU, SATORU
Executed: 2009-12-25
YAMAMOTO, HIROKI
Executed: 2009-12-25
AOYAGI, TAKUYA
Executed: 2009-12-25
Assignee
HITACHI POWDERED METALS CO., LTD.
2-1, MINORIDAI 5-CHOME, MATSUDO-SHI,, CHIBA, JAPAN
Covered Property
(1)
Low Softening Point Glass Composition, Bonding Material Using Same and Electronic Parts
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 9, 2013
From: HITACHI POWDERED METALS CO., LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 031163/0028 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →