Sealing composition and semiconductor device
A first sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and an unbaked hydrotalcite compound having a mole ratio of Mg ion to Al ion (Mg/Al) of 2.4 or more. A second sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (1): Mg 1-x Al x (OH) 2 (CO 3 ) x/2 ·mH 2 O, in which each of x and m independently represents a positive number, and a magnesium-containing compound that is different from the hydrotalcite compound. A third sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (I), and a magnesium oxide, and a content of the magnesium oxide is from 1 part by mass to 50 parts by mass parts with respect to 100 mass parts of the epoxy resin.
1. A sealing composition comprising:
an epoxy resin,
a curing agent,
an inorganic filler comprising magnesium oxide and silica, wherein a ratio by mass of magnesium oxide and silica (magnesium oxide/silica) is 30/1986 to 30/1363 and wherein the magnesium oxide is surface-treated with an inorganic substance to reduce hygroscopicity, and
an unbaked hydrotalcite compound having a mole ratio of Mg ion to Al ion (Mg/Al) of 2.4 or more.
2. The sealing composition according to claim 1 , wherein a content of the unbaked hydrotalcite compound is from 1 part by mass to 15 parts by mass with respect to 100 parts by mass of the epoxy resin.
3. The sealing composition according to claim 1 , wherein a content of the magnesium oxide is from 1 part by mass to 30 parts by mass with respect to 100 parts by mass of the epoxy resin.
4. The sealing composition according to claim 1 , wherein a content of the inorganic filler is from 75% by mass to 97% by mass with respect to the sealing composition.
5. The sealing composition according to claim 1 , further comprising a curing accelerator.
6. A semiconductor device comprising:
a semiconductor element, and
a cured product of the sealing composition according to claim 1 , which seals the semiconductor element.
7. A sealing composition comprising:
an epoxy resin,
a curing agent,
a hydrotalcite compound represented by the following Formula (1);
an inorganic filler comprising magnesium oxide and silica, wherein a ratio by mass of magnesium oxide and silica (magnesium oxide/silica) is 30/1986 to 30/1363 and wherein the magnesium oxide is surface-treated with an inorganic substance to reduce hygroscopicity,
Mg 1-x Al x (OH) 2 (CO 3 ) x/2 ·mH 2 O Formula (1)
wherein, in Formula (1), each of x and m independently represents a positive number.
8. The sealing composition according to claim 7 , wherein a content of the magnesium oxide is from 1 part by mass to 30 parts by mass with respect to 100 parts by mass of the epoxy resin.
9. The sealing composition according to claim 7 , wherein a content of the hydrotalcite compound is from 1 part by mass to 15 parts by mass with respect to 100 parts by mass of the epoxy resin.
10. A semiconductor device comprising:
a semiconductor element, and
a cured product of the sealing composition according to claim 7 , which seals the semiconductor element.
11. A sealing composition comprising:
an epoxy resin,
a curing agent,
a hydrotalcite compound represented by the following Formula (1);
an inorganic filler comprising magnesium oxide and silica, wherein a ratio by mass of magnesium oxide and silica (magnesium oxide/silica) is 30/1986 to 30/1363 and wherein the magnesium oxide is surface-treated with an inorganic substance to reduce hygroscopicity, and
wherein a content of the magnesium oxide is from 1 mass part to 50 mass parts with respect to 100 mass parts of the epoxy resin,
Mg 1-x Al x (OH) 2 (CO 3 ) x/2 ·mH 2 O Formula (1)
wherein, in Formula (1), each of x and m independently represents a positive number.
12. The sealing composition according to claim 11 , wherein a content of the inorganic filler is from 75% by mass to 97% by mass with respect to the sealing composition.
13. A semiconductor device comprising:
a semiconductor element, and
a cured product of the sealing composition according to claim 11 , which seals the semiconductor element.