Patent Assignment
Reel/Frame 047990/0009
Assignment of Assignor's Interest
Recorded: 2019-01-14
Pages: 5
Assignors
KANG, DONGCHUL
Executed: 2018-11-19
HORIE, TAKAHIRO
Executed: 2018-11-12
ISHIBASHI, KENTA
Executed: 2018-11-12
NAMAI, NAOKI
Executed: 2018-11-13
SEKIGUCHI, KAZUHIDE
Executed: 2018-11-13
HORI, KEICHI
Executed: 2018-11-12
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Sealing Composition and Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →