Positive photosensitive resin composition, method of creating resist pattern, and electronic component
View Patent ↗The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.
1. A positive-type photosensitive resin composition, comprising:
an alkali-soluble resin having a phenolic hydroxyl group,
a compound that produces an acid by light,
a thermal crosslinking agent, and
a silane compound having at least one functional group selected from an epoxy group and a sulfide group.
2. The positive-type photosensitive resin composition according to claim 1 , wherein as the silane compound, the positive-type photosensitive resin composition contains a compound having a structure represented by the following formula (1):
wherein R 1 represents a monovalent organic group, and R 2 group represents a divalent organic group.
3. The positive-type photosensitive resin composition according to claim 1 , wherein as the silane compound, the positive-type photosensitive resin composition contains a compound having a structure represented by the following formula (2):
wherein R 3 and R 4 each independently represent a divalent organic group, R 5 and R 6 each independently represent a monovalent organic group, and n represents an integer of 1 to 6.
4. The positive-type photosensitive resin composition according to claim 1 , wherein as the alkali-soluble resin, the positive-type photosensitive resin composition contains a phenol resin.
5. The positive-type photosensitive resin composition according to claim 1 , wherein as the alkali-soluble resin, the positive-type photosensitive resin composition contains a first phenol resin that is a phenol resin having no phenolic hydroxyl group modified with an unsaturated hydrocarbon group-containing compound, and a second phenol resin that is a modified phenol resin having a phenolic hydroxyl group modified with an unsaturated hydrocarbon group-containing compound.
6. The positive-type photosensitive resin composition according to claim 5 , wherein the second phenol resin further has a phenolic hydroxyl group modified with a polybasic acid anhydride.
7. The positive-type photosensitive resin composition according to claim 5 , wherein a content of the first phenol resin is 5 to 95% by mass based on a total of the content of the first phenol resin and a content of the second phenol resin.
8. The positive-type photosensitive resin composition according to claim 1 , wherein the compound that produces an acid by light is an o-quinone diazide compound.
9. The positive-type photosensitive resin composition according to claim 1 , wherein a content of the compound that produces an acid by light is 3 to 100 parts by mass based on 100 parts by mass of a content of the alkali-soluble resin.
10. The positive-type photosensitive resin composition according to claim 1 , further comprising an acrylic resin.
11. The positive-type photosensitive resin composition according to claim 10 , further comprising a compound that produces an acid by heat.
12. The positive-type photosensitive resin composition according to claim 11 , further comprising an elastomer.
13. The positive-type photosensitive resin composition according to claim 10 , further comprising an elastomer.
14. The positive-type photosensitive resin composition according to claim 1 , further comprising a compound that produces an acid by heat.
15. The positive-type photosensitive resin composition according to claim 1 , further comprising an elastomer.
16. A method of producing a resist pattern, comprising:
a first step of applying the positive-type photosensitive resin composition according to claim 1 onto a support substrate, and drying the applied positive-type photosensitive resin composition to form a photosensitive resin film,
a second step of exposing the photosensitive resin film,
a third step of developing the photosensitive resin film after exposure with an alkali aqueous solution to form a resist pattern, and
a fourth step of heating the resist pattern.
17. The method of producing a resist pattern according to claim 16 , wherein the fourth step is a step of heating the resist pattern at a temperature of not more than 200° C.
18. An electronic component having a resist pattern created by the method of producing a resist pattern according to claim 16 as an interlayer insulating layer or a surface protective film.
19. An electronic component having a resist pattern created by the method of producing a resist pattern according to claim 16 as a cover coat layer.
20. An electronic component having a resist pattern created by the method of producing a resist pattern according to claim 16 as a core for redistribution.
21. An electronic component having a resist pattern created by the method of producing a resist pattern according to claim 16 as a collar for holding a conductive ball, which is an external connection terminal.
22. An electronic component having a resist pattern created by the method of producing a resist pattern according to claim 16 as an underfill.