Patent Assignment
Reel/Frame 011762/0874
Assignment of Assignor's Interest
Recorded: 2001-05-04
Pages: 2
Assignor
HASEGAWA, HIDENORI
Executed: 2001-03-30
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANONMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Substrate for Mounting a Semiconductor Chip and Method for Manufacturing a Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.