IP Library › Patent Application 09788664
Patent Application Utility
App. No. 09/788,664 · Confirmation No. 5979

SUBSTRATE FOR MOUNTING A SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Inventor: Hidenori Hasegawa
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2003-08-11 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-08-11 LET. Miscellaneous Incoming Letter 1 View
2001-02-21 TRNA Transmittal of New Application 4 View
2001-02-21 SPEC Specification 7 View
2001-02-21 CLM Claims 2 View
2001-02-21 ABST Abstract 1 View
2001-02-21 DRW Drawings-only black and white line drawings 6 View
2001-02-21 OATH Oath or Declaration filed 3 View
2001-02-21 TRNA Transmittal of New Application 4 View
2001-02-21 SPEC Specification 7 View
2001-02-21 CLM Claims 2 View
2001-02-21 ABST Abstract 1 View
2001-02-21 DRW Drawings-only black and white line drawings 6 View
2001-02-21 OATH Oath or Declaration filed 3 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
09/788,664
Filed
2001-02-21
Granted
2003-10-07
Pub. No.
US20010026005A1
Art Unit
2814
PTA
0 days