Patent Assignment
Reel/Frame 011766/0709
Assignment of Assignor's Interest
Recorded: 2001-04-30
Received: 2001-05-09
Pages: 3
Assignor
MATSUMOTO, AKIRA
Executed: 2001-03-17
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Method for Forming Multi-Layered Interconnect Structure
Application:
09/784,267 →