IP Library › Patent Application 09784267
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App. No. 09/784,267 · Confirmation No. 3052

METHOD FOR FORMING MULTI-LAYERED INTERCONNECT STRUCTURE

Inventor: Akira Matsumoto
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-02-15 TRNA Transmittal of New Application 4 View
2001-02-15 SPEC Specification 19 View
2001-02-15 CLM Claims 4 View
2001-02-15 ABST Abstract 1 View
2001-02-15 DRW Drawings-only black and white line drawings 10 View
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Quick Facts
App. No.
09/784,267
Filed
2001-02-15
Granted
2003-02-04
Pub. No.
US20010027002A1
Art Unit
2822
PTA
0 days