IP Library Assignment 011772/0150
Patent Assignment
Reel/Frame 011772/0150

Assignment of Assignor's Interest

Recorded: 2001-04-30 Received: 2001-05-10 Pages: 3
Assignors
SHIMIZU, KAZUO
Executed: 2001-03-06
TSURUTA, HISAYUKI
Executed: 2001-03-06
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property (1)
Resin-Molding Method, Molding Dies and Circuit Base Member
Application: 09/781,789 →