Patent Assignment
Reel/Frame 011772/0150
Assignment of Assignor's Interest
Recorded: 2001-04-30
Received: 2001-05-10
Pages: 3
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Resin-Molding Method, Molding Dies and Circuit Base Member
Application:
09/781,789 →