IP Library › Granted Patent US 6,676,885
Granted Patent Utility
US 6,676,885 · Confirmation No. 6967

RESIN-MOLDING METHOD, MOLDING DIES AND CIRCUIT BASE MEMBER

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 Code Description Pages PDF
2003-11-24 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-11-24 LET. Miscellaneous Incoming Letter 1 View
2003-11-24 DRW Drawings-only black and white line drawings 23 View
2001-02-12 TRNA Transmittal of New Application 1 View
2001-02-12 SPEC Specification 45 View
2001-02-12 CLM Claims 7 View
2001-02-12 ABST Abstract 1 View
2001-02-12 DRW Drawings-only black and white line drawings 23 View
2001-02-12 OATH Oath or Declaration filed 2 View
2001-02-12 TRNA Transmittal of New Application 1 View
2001-02-12 SPEC Specification 45 View
2001-02-12 CLM Claims 7 View
2001-02-12 ABST Abstract 1 View
2001-02-12 DRW Drawings-only black and white line drawings 23 View
2001-02-12 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,676,885
App. No.
09/781,789
Filed
2001-02-12
Granted
2004-01-13
Pub. No.
US20010013674A1
Art Unit
1732
PTA
-94 days