IP Library › Assignment 011772/0455
Patent Assignment
Reel/Frame 011772/0455

Assignment of Assignor's Interest

Recorded: 2001-05-01 Pages: 3
Assignors
PYAPALI, RAMBABU
Executed: 2001-04-25
YUAN, XUEJUN
Executed: 2001-04-25
JIN, XIAOWEI
Executed: 2001-04-25
LAI, PETER
Executed: 2001-04-25
HADDAD, SAMER H.
Executed: 2001-04-25
WONG, JEFFREY
Executed: 2001-04-25
Assignee
SUN MICROSYSTEMS, INC.
MS PAL01-521, 901 SAN ANTONIO ROAD, PALO ALTO, CALIFORNIA, 94303
Covered Property (1)
Reconfigurable Multi-Chip Modules
Patent: 6,779,131 →
Application: 09/846,943 →
Publication: US 2002/0194447
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Dec 12, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037278/0779 →