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Patent Assignment
Reel/Frame 011778/0649

Assignment of Assignor's Interest

Recorded: 2001-05-08 Pages: 3
Assignors
HANAOKA, TERUNAO
Executed: 2001-04-17
WADA, KENJI
Executed: 2001-04-17
HASHIMOTO, NOBUAKI
Executed: 2001-04-17
ITO, HARUKI
Executed: 2001-04-06
UMETSU, KAZUSHIGE
Executed: 2001-04-16
MATSUSHIMA, FUMIAKI
Executed: 2001-04-06
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device and Manufacturing Method Therefor, Including a Through-Hole with a Wider Intermediate Cavity
Patent: 6,667,551 →
Application: 09/765,433 →
Publication: US 2001/0027011
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 21, 2017
From: SEIKO EPSON CORPORATION
To: ADVANCED INTERCONNECT SYSTEMS LIMITED
Reel/Frame 044938/0869 →