Patent Assignment
Reel/Frame 044938/0869
Assignment of Assignor's Interest
Recorded: 2017-12-21
Pages: 15
Assignor
SEIKO EPSON CORPORATION
Executed: 2017-12-19
Assignee
ADVANCED INTERCONNECT SYSTEMS LIMITED
FIRST FLOOR, BLACKTHORN EXCHANGE, BRACKEN ROAD, SANDYFORD, DUBLIN, D18 P3Y9, IRELAND
Covered Properties
(68)
Semiconductor device and method for making pattern data
Patent:
6,287,948 →
Application:
09/558,530 →
Semiconductor Chip, Semiconductor Device, Circuit Board and Electronic Equipment and Production Methods for Them
Patent:
6,424,048 →
Application:
09/601,411 →
Method for Machining Work by Laser Beam
Patent:
6,563,079 →
Application:
09/673,874 →
Semiconductor Device and Manufacturing Method Therefor, Including a Through-Hole with a Wider Intermediate Cavity
Methods for Manufacturing Semiconductor Chips, Methods for Manufacturing Semiconductor Devices, Semiconductor Chips, Semiconductor Devices, Connection Substrates and Electronic Devices
Semiconductor Device and Method of Manufacturing the Same, Circuit Board and Electronic Instrument
Semiconductor Device, Method of Fabricating the Same, Stack-Type Semiconductor Device, Circuit Board and Electronic Instrument
Semiconductor Device and Method for Manufacturing the Same
Miniature Optical Element for Wireless Bonding in an Electronic Instrument
Wiring Board and Fabricating Method Thereof, Semiconductor Device and Fabricating Method Thereof, Circuit Board and Electronic Instrument
Semiconductor Chip, Semiconductor Device, Circuit Board and Electronic Equipment and Production Methods for Them
Wiring Board and Fabricating Method Thereof, Semiconductor Device and Fabricating Method Thereof, Circuit Board and Electronic Instrument
Semiconductor Device and a Method of Manufacturing the Same, a Circuit Board and an Electronic Apparatus
Semiconductor Device and Method of Manufacturing the Same, Circuit Board and Electronic Instrument
Semiconductor Device and Manufacturing Method Therefor, Circuit Board, and Electronic Equipment
Semiconductor Device and Method of Manufacturing the Same, Circuit Board and Electronic Instrument
Semiconductor Device and Method of Manufacturing the Same, Circuit Board, and Electronic Instrument
Method for Manufacturing Semiconductor Device, Semiconductor Device, Circuit Board, and Electronic Apparatus
Miniature Optical Element for Wireless Bonding in an Electronic Instrument
Semiconductor Device, Method of Fabricating the Same, Stack-Type Semiconductor Device, Circuit Board and Electronic Instrument
Semiconductor Device, Method of Fabricating the Same, Stack-Type Semiconductor Device, Circuit Board and Electronic Instrument
Semiconductor Device, Circuit Board,and Electronic Instrument Suitable for Stacking and Having a Through Hole
Optical Device, Optical Module, Semiconductor Apparatus and Its Manufacturing Method, and Electronic Apparatus
Semiconductor Device, Method for Manufacturing the Same, Circuit Substrate and Electronic Device
Semiconductor Device and Method of Manufacturing the Same, Circuit Board, and Electronic Instrument
Semiconductor Device and Method of Manufacturing the Same, Circuit Board, and Electronic Instrument
Semiconductor Device, Method for Manufacturing the Same, Circuit Board, and Electronic Apparatus
Method of Manufacturing Semiconductor Device
Intermediate Chip Module, Semiconductor Device, Circuit Board, and Electronic Device
Electronic Component, Method of Manufacturing the Electronic Component, and Electronic Apparatus
Method of Manufacturing a Semiconductor Device
Stacked Layered Type Semiconductor Memory Device
Stacked Layered Type Semiconductor Memory Device
Semiconductor Substrate and Thin Processing Method for Semiconductor Substrate
Sealed Surface Acoustic Wave Element Package
Semiconductor Device, Method for Manufacturing Semiconductor Device, Circuit Board, and Electronic Instrument
Manufacturing Method for Electronic Component, Electronic Component, and Electronic Equipment
Semiconductor Device, Manufacturing Method for Semiconductor Device, Electronic Component, Circuit Substrate, and Electronic Apparatus
Miniature Optical Element for Wireless Bonding in an Electronic Instrument
Electronic Substrate and Electronic Device
Semiconductor Device and Electronic Instrument
Electronic Substrate, Semiconductor Device, and Electronic Device
Miniature Optical Element for Wireless Bonding in an Electronic Instrument
Manufacturing Method for Electronic Component with Sealing Film
Manufacturing Method for Interconnection Having Stress-Absorbing Layer Between the Semiconductor Substrate and the External Connection Terminal
Miniature Optical Element for Wireless Bonding in an Electronic Instrument
A Semiconductor Device Having Through Electrodes, a Manufacturing Method Thereof, and an Electronic Apparatus
Sealed Surface Acoustic Wave Element Package
Electronic Substrate, Semiconductor Device, and Electronic Device
Electronic Substrate
A Manufacturing Method for an Electronic Substrate
Semiconductor Device, Circuit Substrate, and Electronic Device
Interconnection of Land Section to Wiring Layers at Center of External Connection Terminals in Semiconductor Device and Manufacturing Thereof
Manufacturing Method for Electronic Component, Electronic Component, and Electronic Equipment
Semiconductor Device, Manufacturing Method for Semiconductor Device, Electronic Component, Circuit Substrate, and Electronic Apparatus
Sealed Electric Element Package
Manufacturing method for semiconductor device
Semiconductor Device, Circuit Substrate, and Electronic Device
Semiconductor Device, Having Through Electrodes, a Manufacturing Method Thereof, and an Electronic Apparatus
An Electronic Substrate
Electronic Substrate, Semiconductor Device, and Electronic Device
Semiconductor Device, Circuit Substrate, and Electronic Device
Semiconductor Device, Manufacturing Method for Semiconductor Device, Electronic Component, Circuit Substrate, and Electronic Apparatus
Semiconductor Device, Having Through Electrodes, a Manufacturing Method Thereof, and an Electronic Apparatus
Semiconductor Device, Manufacturing Method for Semiconductor Device, Electronic Component, Circuit Substrate, and Electronic Apparatus
Application:
14/521,614 →
Publication:
US 2015/0041992
Semiconductor Device, Circuit Substrate, and Electronic Device
Electronic Substrate
Semiconductor Device, Circuit Substrate, and Electronic Device
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 22, 2000
From: UMETSU, KAZUSHIGE; AMAKO, JUN; YOTSUYA, SHINICHI; ARAKAWA, KATSUJI
To: SEIKO EPSON CORPORATION
Reel/Frame 011045/0561 →
Assignment of Assignor's Interest
Sep 14, 2000
From: USHIYAMA, FUMIAKI
To: SEIKO EPSON CORPORATION
Reel/Frame 011093/0734 →
Assignment of Assignor's Interest
Oct 23, 2000
From: UMETSU, KAZUSHIGE; AMAKO, JUN; YOTSUYA, SHINICHI; ARAKAWA, KATSUJI
To: SEIKO EPSON COPORATION
Reel/Frame 011361/0505 →
Assignment of Assignor's Interest
May 8, 2001
From: HANAOKA, TERUNAO; WADA, KENJI; HASHIMOTO, NOBUAKI; ITO, HARUKI
To: SEIKO EPSON CORPORATION
Reel/Frame 011778/0649 →
Assignment of Assignor's Interest
May 17, 2001
From: KOMIYAMA, TADASHI; HARA, AKITOSHI; SATO, EIICHI
To: SEIKO EPSON CORPORATION
Reel/Frame 011810/0343 →
Assignment of Assignor's Interest
Jun 11, 2001
From: HASHIMOTO, NOBUAKI; HANAOKA, TERUNAO
To: SEIKO EPSON CORPORATION
Reel/Frame 011884/0581 →
Assignment of Assignor's Interest
Sep 20, 2001
From: WADA, KENJI
To: SEIKO EPSON CORPORATION
Reel/Frame 012190/0162 →
Assignment of Assignor's Interest
Oct 1, 2001
From: HANAOKA, TERUNAO; WADA, KENJI
To: SEIKO EPSON CORPORATION
Reel/Frame 012215/0519 →
Assignment of Assignor's Interest
Oct 17, 2001
From: WADA, KENJI
To: SEIKO EPSON CORPORATION
Reel/Frame 012266/0707 →
Assignment of Assignor's Interest
Apr 4, 2002
From: EMETSU, KAZUSHIGE; KURASHIMA, YOHEI; AMAKO, JUN
To: SEIKO EPSON CORPORATION
Reel/Frame 012759/0176 →
Assignment of Assignor's Interest
Aug 18, 2003
From: MIYAZAWA, IKUYA; IKEHARA, TADAYOSHI
To: SEIKO EPSON CORPORATION
Reel/Frame 013884/0353 →
Assignment of Assignor's Interest
Mar 30, 2004
From: MIYAZAWA, IKUYA
To: SEIKO EPSON CORPORATION
Reel/Frame 014473/0722 →
Assignment of Assignor's Interest
Apr 26, 2004
From: MIYAZAWA, IKUYA
To: SEIKO EPSON CORPORATION
Reel/Frame 014563/0932 →
Assignment of Assignor's Interest
May 20, 2004
From: MATSUI, KUNIYASU
To: SEIKO EPSON CORPORATION
Reel/Frame 015357/0684 →