Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument
View Patent ↗A method of fabricating a semiconductor device including: a first step of forming a through hole in a semiconductor element having electrodes on a first surface; and a second step of forming a conductive layer which is electrically connected to the electrodes and is provided from the first surface through an inner wall of the through hole to a second surface of the semiconductor element which is opposite to the first surface. The conductive layer is formed to have connecting portions on the first and second surfaces so that a distance between at least two electrodes among the electrodes is different from a distance between the connecting portions on at least one of the first and second surfaces, in the second step.
1. A method of fabricating a semiconductor device comprising:
(a) preparing a semiconductor element defining a first surface and a second surface opposite the first surface, the semiconductor element having a plurality of electrodes above the first surface;
(b) forming holes in the electrodes;
(c) forming through holes in the semiconductor element, each of the through holes communicating with one of the holes; and
(d) forming conductive layer conductive layers which are electrically connected to the electrodes, each of the conductive layers provided from the first surface through an inner wall of one of the through holes and one of the holes to the second surface of the semiconductor element,
the conductive layers being formed to include connecting portions so that a distance between at least two electrodes is different from a distance between the connecting portions on at least one of the first and second surfaces, in the step (d).
2. The method of fabricating a semiconductor device as defined in claim 1 ,
a small hole which has a diameter smaller than a diameter of the one of the through holes being previously formed and enlarged to form the one of the through holes, in the step (c).
3. The method of fabricating a semiconductor device as defined in claim 2 ,
a depression being formed at a position in which the small hole is to be formed.
4. The method of fabricating a semiconductor device as defined in claim 2 ,
the small hole being formed by a laser beam and the small hole being enlarged by wet etching.
5. The method of fabricating a semiconductor device as defined in claim 1 ,
the one of the through holes being formed in an end portion of the semiconductor element; and
the connecting portions being disposed in a center portion of the semiconductor element, on the inside of the one of the through holes.
6. The method of fabricating a semiconductor device as defined in claim 1 , further comprising:
forming a stress relieving layer on at least one of the first and second surfaces before the step (d),
the conductive layers being formed to reach the stress relieving layer in the step (d).
7. The method of fabricating a semiconductor device as defined in claim 6 ,
the forming the stress relieving layer including forming a stress relieving layer having a plurality of projections; and
the step (d) including forming the conductive layers to reach the projections.
8. The method of fabricating a semiconductor device as defined in claim 6 ,
the forming the stress relieving layer including forming a stress relieving layer having a plurality of projections, and forming
a plurality of recessed portions between the adjacent projections; and
the step (d) including forming the conductive layers to reach the recessed portions.
9. The method of fabricating a semiconductor device as defined in claim 6 ,
the connecting portions being formed on the stress relieving layer.
10. The method of fabricating a semiconductor device as defined in claim 1 ,
a distance between adjacent connecting portions among the connecting portions being wider than a distance between adjacent electrodes among the plurality of electrodes.
11. The method of fabricating a semiconductor device as defined in claim 1 , further comprising:
providing external terminals at the connecting portions.
12. The method of fabricating a semiconductor device as defined in claim 11 ,
the providing the external terminals including providing a solder into a thick layer on the connecting portions to form solder balls by wet back.
13. The method of fabricating a semiconductor device as defined in claim 11 ,
a solder being provided on the connecting portions by electroplating or printing.
14. The method of fabricating a semiconductor device as defined in claim 1 , further comprising:
forming a protective film over an area except at least the connecting portions after the step (d).
15. The method of fabricating a semiconductor device as defined in claim 1 , further comprising:
forming an insulating film over an area including the inner wall of the one of the through holes after the step (c) and before the step (d),
the conductive layers being formed on the insulating film in the step (d).
16. The method of fabricating a semiconductor device as defined in claim 15 ,
the insulating film being formed by coating a resin over an area including the inner wall of the one of the through holes.
17. The method of fabricating a semiconductor device as defined in claim 15 ,
the one of the through holes being filled with a resin in forming the insulating film; and
the conductive layers being formed within the one of the through holes, through the resin in the step (d).
18. The method of fabricating a semiconductor device as defined in claim 1 ,
the semiconductor element being a part of a semiconductor wafer.
19. The method of fabricating a semiconductor device, comprising:
stacking semiconductor devices fabricated by the method as defined in claim 1 , and electrically connecting adjacent two semiconductor devices by the conductive layers.
20. The method of fabricating a semiconductor device, comprising:
stacking semiconductor devices fabricated by the method as defined in claim 18 , and electrically connecting adjacent two semiconductor devices by the conductive layers; and
cutting the semiconductor wafer into separate pieces.