Patent Assignment
Reel/Frame 012759/0176
Assignment of Assignor's Interest
Recorded: 2002-04-04
Pages: 3
Assignors
EMETSU, KAZUSHIGE
Executed: 2002-03-22
KURASHIMA, YOHEI
Executed: 2002-03-22
AMAKO, JUN
Executed: 2002-03-25
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Wiring Board and Fabricating Method Thereof, Semiconductor Device and Fabricating Method Thereof, Circuit Board and Electronic Instrument
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.