Manufacturing method for electronic component with sealing film
View Patent ↗A manufacturing method for electronic device, includes: preparing a first substrate having a plurality of first regions; preparing a second substrate having a plurality of second regions; facing the first region and the second region each other, and connecting the first substrate and the second substrate while disposing at least a part of a functional element within a space between the first region and the second region; obtaining a plurality of first divisional substrates by cutting the first substrate at each of the first regions, after the connecting of the first substrate and the second substrate; forming a sealing film covering the plurality of the first divisional substrates on the second substrate, after cutting the first substrate; obtaining a plurality of second divisional substrates by cutting the second substrate at each of the second regions, after forming the sealing film; and obtaining a plurality of individual electronic devices.
1. An electronic device comprising:
a first divisional substrate;
a second divisional substrate facing the first divisional substrate, the second divisional substrate having a first surface and a second surface, the second surface being on an opposite side of the second divisional substrate as the first surface;
an integrated circuit provided on the second surface of the second divisional substrate;
a sealing film which covers the first divisional substrate and forms a sealed space between the first divisional substrate and the second divisional substrate;
a functional element, at least a part of which is disposed within the sealed space, and
a through-hole electrode which penetrates the second divisional substrate and connects the functional element and the integrated circuit, and
a bump provided on the second surface of the second divisional substrate,
wherein the functional element is disposed on a first surface of the second divisional substrate, the first surface facing the first divisional substrate, the functional element being spaced apart from the first divisional substrate.
2. The electronic device according to claim 1 , wherein
the second divisional substrate includes a semiconductor substrate.
3. Electronic equipment comprising the electronic device according to claim 2 .
4. Electronic equipment comprising the electronic device according to claim 1 .
5. The electronic device according to claim 1 , further comprising a terminal-formation face provided on the second surface of the second divisional substrate.
6. The electronic device according to claim 1 , wherein the sealing film is an inorganic film.
7. The electronic device according to claim 1 , wherein the sealing film directly contacts an entire surface of the first divisional substrate that is opposite to a surface that defines the sealed space.
8. An electronic device comprising:
a first divisional substrate having a first major surface and a second major surface;
a second divisional substrate having a first major surface and a second major surface, the first major surface of the second divisional substrate facing the second major surface of the first divisional substrate;
an integrated circuit provided on the second major surface of the second divisional substrate;
a sealing film which directly contacts the first major surface of the first divisional substrate and forms a sealed space between the second major surface of the first divisional substrate and the first major surface of the second divisional substrate;
a functional element, at least a part of which is disposed within the sealed space;
a through-hole electrode which penetrates the second divisional substrate and connects the functional element and the integrated circuit; and
a bump provided on the second major surface of the second divisional substrate,
wherein the functional element is disposed on the first major surface of the second divisional substrate, and the functional element being spaced apart from the second major surface of the first divisional substrate.
9. The electronic device according to claim 8 , wherein the second divisional substrate includes a semiconductor substrate.
10. Electronic equipment comprising the electronic device according to claim 9 .
11. Electronic equipment comprising the electronic device according to claim 8 .
12. The electronic device according to claim 8 , further comprising a terminal-formation face provided on the second major surface of the second divisional substrate.
13. The electronic device according to claim 8 , wherein the sealing film is an inorganic film.