IP Library Assignment 056754/0070
Patent Assignment
Reel/Frame 056754/0070

Assignment of Assignor's Interest

Recorded: 2021-06-03 Pages: 7
Assignor
Assignee
NVIDIA CORPORATION
2788 SAN TOMAS EXPRESSWAY, SANTA CLARA, CALIFORNIA, 95051
Covered Properties (14)
Image-Processing Device, Image-Processing Method and Solid-State Image Pickup Device
Patent: 7,492,402 →
Application: 10/763,121 →
Publication: US 2004/0195599
Image Processing Method, Image Processing Device, Semiconductor Device, Electronic Apparatus, Image Processing Program, and Computer-Readable Storage Medium
Patent: 7,801,355 →
Application: 11/056,352 →
Publication: US 2005/0190200
Sealed Surface Acoustic Wave Element Package
Patent: 7,679,153 →
Application: 11/204,217 →
Publication: US 2006/0055013
Manufacturing Method for Electronic Component, Electronic Component, and Electronic Equipment
Patent: 7,348,263 →
Application: 11/362,591 →
Publication: US 2006/0196408
Semiconductor Device and Electronic Instrument
Patent: 7,664,895 →
Application: 11/483,538 →
Publication: US 2007/0028012
Shake Correction Device, Filming Device, Moving Image Display Device, Shake Correction Method and Recording Medium
Patent: 7,688,352 →
Application: 11/562,596 →
Publication: US 2007/0140674
Image Pickup Device, Method of Controlling Image Pickup Device, and Recording Medium
Patent: 7,693,405 →
Application: 11/563,242 →
Publication: US 2007/0122129
Electronic Substrate, Semiconductor Device, and Electronic Device
Patent: 7,746,232 →
Application: 11/712,361 →
Publication: US 2007/0205956
Manufacturing Method for Electronic Component with Sealing Film
Patent: 7,867,830 →
Application: 12/011,584 →
Publication: US 2008/0128918
Sealed Surface Acoustic Wave Element Package
Patent: 8,227,878 →
Application: 12/695,524 →
Publication: US 2010/0134993
Electronic Substrate, Semiconductor Device, and Electronic Device
Patent: 8,610,578 →
Application: 12/781,179 →
Publication: US 2010/0219927
Manufacturing Method for Electronic Component, Electronic Component, and Electronic Equipment
Patent: 8,664,730 →
Application: 12/961,804 →
Publication: US 2011/0074250
Sealed Electric Element Package
Patent: 8,492,856 →
Application: 13/531,043 →
Publication: US 2012/0261815
Electronic Substrate, Semiconductor Device, and Electronic Device
Patent: 9,251,942 →
Application: 14/079,040 →
Publication: US 2014/0070915
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 28, 2004
From: NASU, HIROAKI
To: SEIKO EPSON CORPORATION
Reel/Frame 015404/0049 →
Assignment of Assignor's Interest May 10, 2005
From: ARAZAKI, SHINICHI
To: SEIKO EPSON CORPORATION
Reel/Frame 016209/0727 →
Assignment of Assignor's Interest Aug 15, 2005
From: ITO, HARUKI; HASHIMOTO, NOBUAKI
To: SEIKO EPSON CORPORATION
Reel/Frame 016899/0300 →
Assignment of Assignor's Interest Feb 24, 2006
From: HASHIMOTO, NOBUAKI
To: SEIKO EPSON CORPORATION
Reel/Frame 017632/0637 →
Assignment of Assignor's Interest Jul 11, 2006
From: NONOYAMA, MIHIRO; KAZUNO, MASATAKA
To: SEIKO EPSON CORPORATON
Reel/Frame 018164/0290 →
Assignment of Assignor's Interest Nov 27, 2006
From: HOSODA, TATSUYA; NAGAISHI, MICHIHIRO; SAKAMOTO, KAZUHIRO
To: SEIKO EPSON CORPORATION
Reel/Frame 018550/0966 →
Assignment of Assignor's Interest Jan 31, 2007
From: NOMURA, KAZUO; SANO, MEGUMI; NAGAISHI, MICHIHIRO; HOSODA, TATSUYA
To: SEIKO EPSON CORPORATION
Reel/Frame 018872/0207 →
Assignment of Assignor's Interest Feb 28, 2007
From: HASHIMOTO, NOBUAKI
To: SEIKO EPSON CORPORATION
Reel/Frame 019054/0154 →
Assignment of Assignor's Interest Dec 21, 2017
From: SEIKO EPSON CORPORATION
To: ADVANCED INTERCONNECT SYSTEMS LIMITED
Reel/Frame 044938/0869 →
Assignment of Assignor's Interest Jul 2, 2018
From: SEIKO EPSON CORPORATION
To: ADVANCED INTERCONNECT SYSTEMS LIMITED
Reel/Frame 046464/0045 →
Assignment of Assignor's Interest May 21, 2021
From: HASHIMOTO, NOBUAKI
To: SEIKO EPSON CORPORATION
Reel/Frame 056318/0214 →
Assignment of Assignor's Interest May 21, 2021
From: ITO, HARUKI; HASHIMOTO, NOBUAKI
To: SEIKO EPSON CORPORATION
Reel/Frame 056318/0287 →
Assignment of Assignor's Interest May 21, 2021
From: HASHIMOTO, NOBUAKI
To: SEIKO EPSON CORPORATION
Reel/Frame 056318/0277 →