IP Library › Assignment 056318/0214
Patent Assignment
Reel/Frame 056318/0214

Assignment of Assignor's Interest

Recorded: 2021-05-21 Pages: 4
Assignor
HASHIMOTO, NOBUAKI
Executed: 2006-02-07
Assignee
SEIKO EPSON CORPORATION
4-1 NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0811, JAPAN
Covered Properties (2)
Manufacturing Method for Electronic Component with Sealing Film
Patent: 7,867,830 →
Application: 12/011,584 →
Publication: US 2008/0128918
Manufacturing Method for Electronic Component, Electronic Component, and Electronic Equipment
Patent: 8,664,730 →
Application: 12/961,804 →
Publication: US 2011/0074250
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 21, 2017
From: SEIKO EPSON CORPORATION
To: ADVANCED INTERCONNECT SYSTEMS LIMITED
Reel/Frame 044938/0869 →
Assignment of Assignor's Interest Jun 3, 2021
From: ADVANCED INTERCONNECT SYSTEMS LIMITED
To: NVIDIA CORPORATION
Reel/Frame 056754/0070 →