Sealed surface acoustic wave element package
View Patent ↗An electronic component includes: a semiconductor substrate having a first surface and a second surface opposing to the first surface; a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface; an electronic element provided in the vicinity of the first surface of the semiconductor; and a sealing member that seals the electronic element between the sealing member and the first surface, wherein the electronic element is electrically connected to the trans-substrate conductive plug.
1. An electronic component comprising:
a semiconductor substrate having a first surface and a second surface opposing to the first surface;
a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface;
an electronic element provided on the first surface of the semiconductor substrate, the electronic element including a surface acoustic wave element;
a sealing member that seals the electronic element between the sealing member and the first surface; and
an integrated circuit which is provided on the second surface of the semiconductor substrate at a position outside of the sealed area by the sealing member, and drives and controls the electronic element, the integrated circuit including a transistor and a memory element;
wherein the electronic element and the integrated circuit are electrically connected to the trans-substrate conductive plug.
2. The electronic component according to claim 1 , wherein the second member comprises the sealing member.
3. The electronic component according to claim 1 , wherein the second member comprises a second substrate provided between the first surface and the sealing member.
4. The electronic component according to claim 1 , further comprising a connecting terminal for connecting to an external apparatus, the connecting terminal being provided above the second surface of the semiconductor substrate.
5. A circuit board comprising the electronic component according to claim 1 mounted on the circuit board.
6. An electronic apparatus comprising the electronic component according to claim 1 .
7. The electronic component according to claim 1 , further comprising:
a connecting terminal for connecting to an external apparatus, the connecting terminal being provided above the second surface of the semiconductor substrate, wherein:
the first surface of the semiconductor substrate is substantially flat;
the second surface of the semiconductor substrate is substantially parallel to the first surface;
at least a part of the trans-substrate conductive plug is provided on a plane parallel to the first surface within an area corresponding to the electronic element; and
at least a part of the connecting terminal is provided on a plane parallel to the first surface within an area corresponding to the electronic element.